I'm facing dependency conflicts in my Flutter project when using thepackage_info_pluspackage. The issue comes becausepackage_info_plushas specific version requirements for thehttppackage, which are incompatible with other packages in my project. Despite multiple attempts to resolve the...
新建flutter项目后,查看iOS原生端info.plist文件的定义,其中Bundle version string (short)的值为: (FLUTTER_BUILD_NUMBER) info.plist.png 而这时我们使用package_info_plus获取的version和buildNumber得到的值是flutter端pubspec.yaml中version的值,与安卓表现一致。 但是鉴于一个flutter项目,iOS与安卓版本号和build的值...
{"name":"package_info_plus","path":"/Users/deepindo/.pub-cache/hosted/pub.flutter-io.cn/package_info_plus-3.0.3/","native_build":true,"dependencies":[]},{"name":"shared_preferences_foundation","path":"/Users/deepindo/.pub-cache/hosted/pub.flutter-io.cn/shared_preferences_foundation...
import 'package:package_info_plus/package_info_plus.dart'; late String appName; late String packageName; late String version; late String buildNumber; Future<void> init() async { PackageInfo packageInfo = await PackageInfo.fromPlatform(); appName = packageInfo.appName; packageName = packageInf...
方法/步骤 1 于是我各种百度线刷,失败无法识别。2 卡刷各种卡刷包刷了,还是无法开机。3 最后还去找qq群的人结果被骗了100块钱。。。最终我误打误撞,按了开机键,然后按音量上键,进入了一个华为的自带升级界面,它需要你登wifi 登录了以后扫描不到包。。。4 提示——Getting package info failed 解决...
I'm a new Flutter developer, I'm about to develop a Flutter app which needs to use device id so I decided to use the device_info_plus package to get androidId, but when I request device info in order to get androidId within it, it returns null and also does ...
The article offers information on the upgradation of 'Pakistan Plus Package' by Pakistan Telecommunication Co. Ltd. (PTCL).Flare
I have a problem with my Huawei Nova Plus AL10 (chineese version), i tried to update the version from 6 toNougat 7 with Huawei firmware finder, when arrived at 100%, it reboots and stucks in Huawei eRecovery (Getting package info failed msg appears). Than i tried to downlad the o...
// Be sure to add this line if `PackageInfo.fromPlatform()` is called before runApp()
Cadence®Allegro®Package Designer Plus能够实现约束驱动的设计校正的封装基板布局。它支持用于单芯片和多芯片BGA / LGA封装设计的完整的从前端到后端的物理实现流程。提供了一组针对特定封装特性的强大功能,例如动态库开发,连接生成/优化,多层引线键合,协同设计,管芯堆叠和TSV,嵌入式腔体,推式布线,报告和量产输出。