网络片上整合 网络释义 1. 片上整合 ...的系统功能以14接脚SOIC形式独立封装。另外,片上整合(on-chip integration)允许使用单个介面控制所有功能,作业电压范 … www.eettaiwan.com|基于3个网页
J. Yang, P. Bhattacharya, G. Qin and Z. Ma, "On-chip integration of InGaAs/GaAs quantum dot lasers with waveguides and modulators on silicon," in Novel In-Plane Semiconductor Lasers VII, San Jose, 2008.J. Yang, P. Bhattacharya, G. Qin, and Z. Ma, "On-chip integration of InGaAs/...
1) integration on chip 芯片集成化2) integrated chip 集成芯片 1. Three-phase inverter power supply design proposal was proposed using the 89C51 single-chip control technology unified with high accuracy three-phase programmable PWM integrated chip SA4828, elaborated the principle, advantages and the ...
稿件投诉 Selective Epitaxy: A direct epitaxy approach to achieve a monolithic on-chipintegration of LEDs and HEMTs for micro-display and VLC 王涛 教授 英国谢菲尔德大学 展开更多 limit发消息 分享知识,共同成长。把复杂的事情掰扯明白! 关注1万
On-chip Integration The next question that needs to be answered is where to integrate the on-chip regulators. Generally, the regulator should be integrated onto the same chip that needs to be supplied. This requires regulators to be available in the same process technology as the application....
The technology is amenable to integration with both photonic elements and silicon microchips. Establishing devices that provide a RF to optical link on a chip may catalyze a wide variety of applications such as integrated, atomic clocks and on-chip, and could contribute to makingoptical frequencymet...
silicon integration technologies 硅集成技术，System-on-Chip 系统集成芯片，System-on-Package 系统级封装，CMOS 储存BIOS基本设置数据的记忆芯片Complementary Metal-Oxide Semiconductor （本意是指互补金属氧化物半导体——一种大规模应用于集成电路芯片制造的原料）
While heterogeneous integration is still in its early stages, the integration of different chips and discrete components side by side on a common substrate (ceramic, silicon/glass or organic) is not a new concept. Technologies such as multichip module (MCM) and SiP have been around for decades...
A primary limit on the types of electronic (or other) functions that will be integrated into future SOCs is cost of integration, which tends to grow non-linearly with process complexity and chip area. A near-continuum of System-on/in-X solutions is emerging between traditional System-on-Chip...
Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany Tianming Li, Jiang Qu, Vineeth Kumar Bandari, Feng Zhu & Oliver G. Schmidt Material Systems for Nanoelectronics, Chemnitz University of Technology, 09107, Chemnitz, ...