新加坡 2025-05更新 唯一实体编号(UEN): 201207875E 成立日期: 2012-03-30 企查查编码: QSGP3R01F4 注册地址: 1 VENTURE AVENUE, #04-02, PERENNIAL BUSINESS CITY, SINGAPORE 608521 工商信息 唯一实体编号(UEN) 201207875E 企业名称 OMNIVISION TECHNOLOGIES SINGAPORE PTE. LTD. ...
OmniVision Technologies Inc 型号: OVM9724-RYDA 品牌: OmniVision Technologies Inc 封装: Module 批次: - 数据手册: 描述: IC IMAGE SENSOR 720P 28-CSP3 购买数量: 库存:请查询 产品信息 参数信息 用户指南 MfrOmniVision Technologies Inc Type-
OmniVision Technologies Inc 型号: OVM6211-RADA 品牌: OmniVision Technologies Inc 封装: Module 批次: - 数据手册: 描述: IC SENSOR 400X400 1/10.5" 29CSP3 购买数量: 库存:请查询 产品信息 参数信息 用户指南 MfrOmniVision Technologies Inc
Image Sensor SANTA CLARA, Calif., March 3, 2016 — OmniVision Technologies Inc. has announced the OV2744 PureCel image sensor, enabling advanced biometric capabilities such as facial recognition for front-facing cameras in notebooks, tablets and smartphones. The 1.4-μm, 1/6-in. sensor features...
型号: OV02710-A68A 品牌: OmniVision Technologies Inc 封装: 68-CSP3 (7.46 x 5.87) 批次: - 数据手册: 描述: SENSOR IMAGE CMOS 2MP 68-CSP3 购买数量: 库存:请查询 产品信息 参数信息 用户指南 MfrOmniVision Technologies Inc TypeCMOS with Processor ...
OmniVision Technologies Inc 型号: OVP0921-A44G 品牌: OmniVision Technologies Inc 封装: - 批次: - 数据手册: - 描述: DISPLAY LCOS WIRELESS 144WLCSP 购买数量: 库存:请查询 产品信息 参数信息 用户指南 MfrOmniVision Technologies Inc TypeCMOS with Processor ...
型号: OV02B10-A25A-001A 品牌: OmniVision Technologies Inc 封装: 25-CSP (4.53x3.07) 批次: - 数据手册: 描述: CAMERA SENSOR 2MP COLOR 25CSP 购买数量: 库存:请查询 产品信息 参数信息 用户指南 MfrOmniVision Technologies Inc TypeCMOS with Processor ...
型号: OV10625-N02V-RE 品牌: OmniVision Technologies Inc 封装: 102-aCSP (7.31x7.81) 批次: - 数据手册: 描述: IMAGE SENSOR 购买数量: 库存:请查询 产品信息 参数信息 用户指南 MfrOmniVision Technologies Inc TypeCMOS with Processor SeriesOmniHDR® ...
OmniVision Technologies Inc 型号: OV00570-B44G 品牌: OmniVision Technologies Inc 封装: - 批次: - 数据手册: - 描述: IC ASIC TV ENCODER USB 144BGA 购买数量: - + 询价 加入询价列表 库存: 请查询 请发送RFQ,我们将立即回复。 联系人姓名 电子邮箱 公司名称 国家 Afghanistan Aland Islands ...
As integrated circuit technologies continue to advance, there are continuing efforts to increase performance and density, improve form factor, and reduce costs. The implementation of stacked three dimensional integrated circuits have been one approach that designers sometimes use to realize these benefits....