4) tail fin 尾部稳定器<火>5) stable compensating 稳定补偿 例句>> 6) compensation of stability 稳定性补偿补充资料:补偿器 分子式:CAS号:性质:仪表的一种辅助装置,用以抵消由规定工作条件变化所造成的误差。是由特殊结构、附加设施、线路或特殊材料等构成。 说明:补充资料仅用于学习参考,请勿用于其它...
A heat-exchanger offset fin is a heat-exchanger offset fin which is disposed among a plurality of refrigerant tubes arranged in parallel. A plurality of segments, each of which is an individual fin cut and lifted into strips from the rising surfaces and falling surfaces of the fin which is ...
PROBLEM TO BE SOLVED: To provide a fin having a reduced fin pitch, an increased offset amount, and suited for mass production by a method wherein the cut/raised position of the rising surface of each wave and the cut/raised position of a falling surface are differed from each other in ...
网络释义 1. 复制费 出版专业英语词汇 - 清扬古风的日志 - 网易博客 ... offprint 选印本,抽印本 offset fee 复制费 offset lithography 胶印 ... 2000gu.blog.163.com|基于20个网页您要找的是不是 offset offsetting off setting offsets offset fin...
An offset fin (1) for a heat exchanger is formed by bending a metal plate (M) into a rectangular corrugated shape having peaks (11) and valleys (12). The apexes (11a) of the adjacent peaks in a first direction are connected to each other, and the floor portions (12a) of the adjac...
美[ˈɔːfset]英 [ˈɒfset] vt.抵消;补偿;弥补 adj.胶印的 n.抵消;补偿;平版印刷;出发;开端 复数:offsets过去式:offset现在分词:offsetting过去分词:offset第三人称单数:offsets off 离开 + set 开始;建立 CET6考研IELTSTEM8GMATGRE offset ...
1、有效位数(ENOB):模数转换器(ADC)与输入频率fIN相关的测试指标(位)。随着fIN的增大,整体噪声(特别是失真成分)将会增大,因而降低了ENOB和SINAD性能。另注:位数和有效位数的区别 因为理想的ADC(只包含量化噪声)的信噪比可有公式: SNR = (1.76 + 6.02*N)dB ...
A three-dimensional analysis is carried out to study the effect of the fin-pitch irregularity on the heat transfer and the flow characteristics of offset fins for Reynolds number as low as 100 based on the hydraulic diameter. The results obtained are as follows. (1) The Nusselt number of th...
1、有效位数(ENOB):模数转换器(ADC)与输入频率fIN相关的测试指标(位)。随着fIN的增大,整体噪声(特别是失真成分)将会增大,因而降低了ENOB和SINAD性能。另请参考:信号与噪声 + 失真比(SINAD)。ENOB与SINAD的关系式为: 注:位数和有效位数的区别 因为理想的ADC(只包含量化噪声)的信噪比可有公式: ...
A passive cooling unit for integrated electronics in form of flat-plate heat-pipe device having a shallow cavity base member, a cover plate, and a lanced-offset fin member and associated porous metal wick material sandwiched therebetween, the fin member being braced to the base member and cover...