Compact SMD Package:SOP8 package size of 10cm x 10cm x 3cm makes it easy to integrate into various designs. Rib24p|Pcrbdr24|High-Capacity Memory:AT24C256N-SU27 offers 32Kb of non-volatile memory, ideal for long-term data storage. Bulk Quantity:10 pieces/lot ensures ample supply for multi...
BGA Package Pitch Fine pitch BGA packages ≤ 0.8mmSmall BGAs with pitch ≤ 0.5mm Lower density BGA packages with >1mm pitch Package Size Packages with high pin counts Larger package sizes above 15mm x 15mm Application Space Constraints Portable consumer electronics where space is critical - Process...
为满足发展的需要,在原有封装品种基础上,又增添了新的品种——球栅阵列封装,简称BGA(Ball Grid Array Package)。UV绑定与Underfi...[详细] 比Underfill底部填充胶更实惠的BGA四角绑定用胶方法 2015-04-18UV邦定与底部填充的目的,都是为了加强BGA与PCB板的贴合强度,分散和降低因震动引起的BGA突点张力和应力。UV...
PURPOSE: An interconnection board for an NSMD(non solder mask defined)-type BGA(ball grid array) package is provided to avoid a crack in a pattern by reducing concentration of stress on an interface between an interconnection pattern and a solder mask. CONSTITUTION: A body of a board is ...
The CY3JM is available in HC-49 Package, is part of the Crystals, , and with support for Crystals 3.6864MHz CRYSTAL. The CY3JMS is Crystals 3.6864MHz 18pF 0C +70C manufactured by Crystek. is part of the Crystals, , and with support for Crystals 3.6864MHz 18pF 0C +70C. The CY3JMS...
The NSMD020 is available in 1206 Package, is part of the IC Chips. NSMD025 with circuit diagram manufactured by SEA&LAND. The NSMD025 is available in 1206 Package, is part of the IC Chips. 技术参数 制造商 SEALAND 包装 Tape & Reel (TR)/Cut Tape (CT)/Tray/Tube RoHs Status...
Package Size: 13cm x 10cm x 3cm (5.12in x 3.94in x 1.18in) Dissipation Power: Standard Operating Temperature: Standard Features: **High-Quality Integrated Circuits** The 20PCS New and Original SOP8 NE5532 SOP N5532 SMD is a premium collection of integrated circuits designed for a wide ...
NSMD050-16V（G版）1.Product Dimensions &Outline Drawing &marking （Unit:mm ）T 05 Manufacturer's Trademark Part Identification 2.Electrical Properties Model I H (A)I T (A)V max (V)I max (A)TTT (Max time to trip)Pd typ （W ）R min (Ω)R1max (Ω)(A)(S)NSMD0500.50 1....
Hard-switching 750 V, 200 A EDT2 discrete in TO-247PLUS SMD package technology has been developed to fulfill the demand in CAV applications such as delivery vehicles, trucks and bus drive inverters. The TO-247PLUS SMD package, an upgrade to the existing TO-247PLUS package, enabling package...
公开/公告日期: 2007-03-29 申请(专利权)人: SAMSUNG ELECTRONICS CO LTD 发明人: K Shin,金信,OS Yong,呉 世容 摘要: PROBLEM TO BE SOLVED: To provide a ball grid array semiconductor package capable of improving drop test reliability and board level TC (temperature cycle) reliability.收藏...