SEMICONDUCTOR PACKAGE EQUIPPED WITH SOLDER MASK DEFINED (SMD) BONDING PAD AND NON-SOLDER MASK DEFINED (NSMD) BONDING PAD, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR MODULEPROBLEM TO BE SOLVED: To provide a ball grid array semiconductor package capable of improving drop test reliability and board level TC (temperature...
The solder ball pads 32 may be non-solder mask defined (NSMD) type solder ball pads. The solder ball pad 32 and a portion of the connecting pattern 34 connected to the solder ball pad 32 are exposed through an opening 43 of a solder mask 40. Reference numeral 24 is an exposed ...
(SMD) bond pad whose periphery is respectively covered by the solder mask layer104and a solder mask section107. With an appropriate amount of solder paste108being applied on the bond pads102a,102b,the edges of a passive component110can be bonded to the solder paste108and thus in electrical...
A first portion of the plurality of bonding pads are soldermask defined (SMD) bonding pads ( 56 ) and a second portion of the plurality of bonding pads are non-soldermask defined (NSMD) bonding pads ( 58 ). Using a combination of SMD and NSMD bonding pads provides the advantages of ...
United States Patent US7098407 Note: If you have problems viewing the PDF, please make sure you have the latest version ofAdobe Acrobat. Back to full text
In the NSMD pad, the solder mask opening is larger than the copper pad. Thus, the surface land pad’s copper surface is completely exposed, providing greater area to which the BGA solder ball can adhere. Refer to the Side View of NSMD and SMD Land Pads figure for the side view of ...
The bonding pads may include non-solder mask defined (NSMD) bonding pads and solder mask defined (SMD) bonding pads that may be alternately arranged on the substrate. The SMD bonding pads may have sufficient reliability with respect to a drop test and the NSMD bonding pads may have ...