Thermal Release Tape For Hard Substrate NWS-Y5V/NWS-TS322F Solvent Resistance Dicing Tape(Under Development) Semiconductor Wafer Tape SWT 10T+ Thickness(mils)5.03 Adhesive strength(oz/inch)5.48 Carrier typePVC Semiconductor Wafer Tape SWT 20T+ ...
Thermal Release Tape For Hard Substrate NWS-TS322F Solvent Resistance Dicing Tape Semiconductor Wafer Processing Tape SWT 20+R Thickness(mm)0.075 Adhesive strength(N)1.0 Carrier typePVC Semiconductor Wafer Processing Tape SWT 10T+R Thickness(mm)0.128 ...
热分离胶带 日东REVALPHA Thermal-release热释放胶带 热剥离胶带 昆山沛菲特光学材料有限公司8年 月均发货速度:暂无记录 江苏 昆山市 ¥120.00 NITTO日东535A聚合物薄膜基材胶带高低粘强弱双面胶带厚度0.12mm 深圳市轩裕新材料有限公司1年 月均发货速度:暂无记录 ...
热分离胶带 日东REVALPHA Thermal-release释放胶带 热剥离胶带 昆山沛菲特光学材料有限公司8年 月均发货速度:暂无记录 江苏 昆山市 ¥4474.60 日东VR-5300 可以粘合橡胶聚丙烯或弯曲表面的双面胶带 VR-5300H 厦门市集鑫美科技有限公司5年 月均发货速度:暂无记录 ...
In the beginning there was plastic tape, a commonplace products whose main application was electrical insulation, Through the development of a variety of new technologies/functions and applications, we have created demand from new customers in growing industries, including electric wire manufacturers, hou...
Harness protection PVC tape Thin but abrasion-resistant tape contributes to the weight reduction of cars Impact on society Life cycle CO2 emissions: -46% Mobility weight: -1.3kg/vehicle ※ Calculated using data for the car model. The reduction rate differs depending on the car model. ...
热分离胶带 日东REVALPHA Thermal-release热释放胶带 热剥离胶带 昆山沛菲特光学材料有限公司8年 月均发货速度:暂无记录 江苏 昆山市 ¥1080.00 日东3800A 厚度0.05mm NITTO 3800A 临时固定胶带 上海裕宽电子科技有限公司9年 月均发货速度:暂无记录 上海市松江区 ...
A double coated tape including a glass cloth carrier, a pressure sensitive adhesive layer on each side of the carrier, and a porous release liner. The pressure sensitive adhesive le
Disclosed is a thermal-release double-coated pressure-sensitive adhesive tape or sheet which includes a substrate, a foaming agent-free pressure-sensitive adhesive layer (A) arrange
Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet....