1. What is an ideal concentration of Nickel Acetate Tetrahydrate for electroplating?2. Does the metal (let's say a fork) have to be plated with another metal before the nickel plating?3. Does the anode I use have to be of the same metal as the salt solution?4. Where can I find inf...
PROBLEM TO BE SOLVED: To provide nickel columns having uniform height and a nickel under bump metal having a smooth surface which are useful in semiconductor assembly techniques.SOLUTION: Electroplating is performed with a nickel plating solution; which contains nickel ions, sulfamic acid ions, and ...
ELECTROLESS NICKEL PLATING SOLUTION An electroless nickel plating solution, comprising - a source of nickel ions, - a source of molybdenum ions, - a source of tungsten ions, - a source of hypophosphite ions - at least one complexing agent, - at least one organic sulphur co... B Holger,S...
A dark environment is provided about the PN junctions to avoid deplating aluminum from some of the aluminum pads due to photo-electric currents in the immersion solution. The masking layer prevents formation of unwanted spurious nickel ... L Jones,NC Mcgrath - US 被引量: 56发表: 1980年 Elec...
Nickel plating solution, electroless, solution A|镍电镀溶液 基本信息更多信息 中文名称:镍电镀溶液 中文同义词:镍电镀溶液 英文名称:Nickel plating solution, electroless, solution A 英文同义词:Nickel plating solution, electroless, replenishing solution C;Nickel plating solution, electroless, solution B;Nickel...
NICKEL PLATING SOLUTION, ELECTROLESS Basic information More.. Product Name: NICKEL PLATING SOLUTION, ELECTROLESS Synonyms: NICKEL PLATING SOLUTION, ELECTROLESS CAS: MF: Ni MW: 58.6934 EINECS: Mol File: Mol File Information Error Report Your Email: ...
Nickel electroplate is deposited onto products by placing them in an aqueous solution of nickel salts, connected as the cathode. Nickel anodes are used to complete the circuit, these dissolve during the plating process to maintain the overall nickel metal concentration in the solution. Organic additi...
PROBLEM TO BE SOLVED: To provide a zinc-nickel alloy plating solution that can attain a plated layer having corrosion resistance equal to or above that of a cadmium plating or a cadmium-titanium alloy plating but not containing cadmium as a harmful material at all, can use a coating film la...
The present invention relates to an electrolytic zinc-nickel alloy plating solution, which comprises a plating solution containing zinc chloride, nickel chloride, and potassium chloride; polyethylene glycol having a molecular weight of 400-800 as a nonionic surfactant in an amount of 0.01-1.0 gram/li...
United States Patent US9644279 Note: If you have problems viewing the PDF, please make sure you have the latest version ofAdobe Acrobat. Back to full text