conductor when the first conductor is exposed; (d) removing a first portion of the first conductor that is exposed in the first contact hole; and (e) after the first portion of the first conductor is removed, etching the remaining second insulating layer portion to expose the second conductor...
through the SiO2film 202 and the Al film 203, the invention is not limited to such the s tacked structure. An electron resist film may be formed on a surface of a semiconductor substrate and may be formed over the substrate through at least one of films made of conductor and/or ...