必应词典为您提供multi-chippackage的释义,网络释义: 多芯片系统封装;多芯片封装;
Integrated to bring flagship performance Equip mobile devices for the age of AI and 5G. DRAM and NAND come together in a single compact package to deliver flagship-level performance. LPDDR5 uMCP brings high-bandwidth storage and memory, crucial for the increasingly data-heavy demands of smartphone...
MULTI-CHIP PACKAGEPROBLEM TO BE SOLVED: To provide a multi-chip package for increasing the degree of freedom of arrangement and layout of each IC chip for composing the multi-chip package.NISAKA MINORU仁坂 稔
(multi-chip package), unlike installing several separate semiconductors horizontally, stacks them vertically, which minimizes the space used by the chips. As we can add many features in a limited space with an MCP, it is necessary for devices like smartphones, tablet PCs, and other portable ...
A multi-chip package substrate for both flip-chip bumping and wire-bonding applications comprises a substrate body having a top surface and a bottom surface. A plurality of bumping pads and a plurality of wire-bonding pads are formed on the top surface. The bumping pads are disposed on the ...
A multichip light-emitting-diode (LED) package includes a printed circuit board (PCB) having a tapered via hole and a circuit interconnection line on a surface of the PCB. An inclined surface of each via hole is used as a reflection plate reflecting light emitted by an LED chip located in...
High Thermal Conduction Package Technology for Flip Chip Devices The technology of new packages with high thermal conduction performance, simplified structure, and also high reliability for flip chip devices is described... M Kohara,S Nakao,K Tsutsumi,... - 《IEEE Transactions on Components Hybrids...
A multi-chip package comprises a package substrate (200) having bond fingers (220), a first chip (210) having first bonding pads on its center portion, insulating support structures (260) formed on the first chip, a bonding wire (230) connected between bond fingers and first bonding pads,...
PURPOSE: A method for manufacturing a multi-chip package is provided to reduce manufacturing cost for a leadframe, by making an inner lead and a die pad firmly supported by molding resin so that fixing tape is unnecessary and a down-set process is not performed in manufacturing the leadframe...
has developed a Multi-Chip Package (MCP) of 1.4mm thickness that can stack 9 layers. Toshiba has utilized advanced process and mounting technology to shrink each memory chip to 70 micron thickness, the thinnest in the world for MCP applications and then bond the chips together in one package...