. When I use Replace>Padstack it changes all mounting holes with that padstack in the board and I only need to change one. The mounting hole does not have ref des or pin number so there's no way to isolate that change into that specific hole....
What's the easiest way to change one and only one padstack from a mounting hole?. When I use Replace>Padstack it changes all mounting holes with that padstack in the board and I only need to change one. The mounting hole does not have ref des or pin number...
A surface mounting pad 1 is formed by electroless copper plating at the size of 700 μm and a through hole 2 plated simultaneously with the dummy pattern 4 in that region. The surface mounting pad 1, the through hole 2 and the dummy pattern 4 are connected not electrically but ...
On the solder side of the circuit board the solder pad is substantially C- shaped and partially surrounds a non-plated through-hole. Via holes prvide electrical connection between the pad on the solder side of the board and the corresponding pad on the component side of the circuit boards. ...
The socket conductors are to make electrical contact with a probing pad structure disposed on a surface area around a thermal attach mounting hole of a circuit board in response to a loading attachment engaging with the elongated body via the second channel, the socket frame via the first ...
PROBLEM TO BE SOLVED: To provide a vent hole mounting member for improving productivity of a foam molding with easy attachment to or replacement of the member and satisfactory exhausting function of gas and residual air out of a mold by reducing material loss of pan and pan mounting step....
wiring pattern with a component mounting pad or a through hole for interlayer connection use and the like by a method wherein the pad on the surface of a printed board and the through hole are connected with each other by the wiring pattern of roughly the same width as that of the pad....
;SOLUTION: The width 7 of a wiring pattern 6, which connects a component mounting pad 2 with a through hole 3 for interlayer connection use, is formed in roughly the same width as that 8 of the pad 2. Moreover, in the case where the diameter 9 of the hole 3 is larger than the ...
PURPOSE: An electronic component mounting structure and a manufacturing method thereof are provided to prevent damages on circuit elements located beneath the vicinity of a contact pad by forming a via hole by etching dielectric layer on the contact pad of a semiconductor chip by using a laser. ...
directly under an insulation layer with a dummy pattern sufficiently larger than a through hole made in the insulation layer at a position facing the through hole and connecting the circuit layer with the dummy pattern through the through hole thereby enhancing adhesion of a surface mounting pad.SU...