DRAM COMPONENTS Manufacturer Samsung Part Number K4AAG085W?-BCTD Package Standard Monolithic 78-ball FBGA Die Density / Count 16 Gb / 1 die 秃秃兔兔图图 初级粉丝 1 登录百度帐号 扫二维码下载贴吧客户端 下载贴吧APP看高清直播、视频! 贴吧页面意见反馈 违规贴吧举报反馈通道 贴吧违规信息处理公示1...
Alliance Memory Launches New Monolithic High-Speed, Low-Voltage CMOS DDR3L SDRAM With 8-Gb Density in...
Array packages may include the PGA, BGA, FBGA, Fan-in QFN, and Fan-out WLPs and may utilize attachments such as solder balls or columns. Stress relief from wire bonding, ball bonding, column attaching may be mitigated in the 3DIC stack. For example, conductive bond pad 690 may be ...
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Package : Standard Monolithic 78-ball FBGADie Density / Count : 8 Gb B-die (Boltzmann / 20 nm) / 1 dieComposition : 1024Mb x8 (64Mb x8 x 16 banks)Clock Frequency : 1333 MHz (0.750 ns)Minimum Timing Delays : 18-19-19-39-58Read Latencies Supported : 24T, 23T, 22T, 21T, 20T,...