历史名称:1998年2月27日 MITSUI COPPER FOIL (HONG KONG) CO., LIMITED 三井銅箔(香港)有限公司 购买报告 🛒点此购买“ 三井銅箔(香港)有限公司/MITSUI COPPER FOIL (HONG KONG) CO., LIMITED ”的简单版报告 信息包括:企业背景(工商信息,控股企业,变更记录,现任董事资讯, 主要人员(首任股东创办人名称,首任...
英文名称/English Name:MITSUI COPPER FOIL (HONG KONG) CO., LIMITED 成立日期/Date of Establishment:1998-02-27 公司类別/Company Category:私人股份有限公司/Private Company Limited by Shares 公司现状/Active Status:仍注册 🛒购买三井铜箔(香港)有限公司即时付费报告(付费后30分钟返回报告结果) ...
三井銅箔(香港)有限公司是一家香港公司,該頁面展示了三井銅箔(香港)有限公司的中文名稱、英文名稱、注冊編號、商業登記號、成立日期、改名日期、公司狀態、變更歷史等信息,提供三井銅箔(香港)有限公司詳情企業報告定購服務。 已经成立了26年6个月14天。 MITSUI COPPER FOIL (HONG KONG) CO., LIMITED is a Hong Ko...
Mitsui Copper Foil (Suzhou) Co., Ltd is a trading company registered in China, you can buy more information about the company for a fee. Note: There is no guarantee that there will be contact information. 三井铜箔(苏州)有限公司是一家在中国注册的貿易
Mitsui Copper Foil (M) attains ISO/TS 16949:2002.(Products)(Brief Article)
TOKYO--(BUSINESS WIRE)--Mitsui Mining & Smelting Co., Ltd. (TOKYO: 5706) (President: Keiji Nishida; “Mitsui Kinzoku,” hereinafter) is pleased to announce today that it is establishing a marketing base for copper foil business in China. ...
Q&A at the Explanation Meeting on the Copper Foil and Engineered Powders[PDF:2342KB] 2025/02/21 Financial Results Reports Material for the Explanation Meeting on the Engineered Materials Business[PDF:2883KB] Business introduction Business segment ...
The largest producer of copper foil is Mitsui Kinzoku (Mitsui Mining & Smelting). Mitsui Kinzoku has been increasingly focussing on its electronics material business in recent years and this sector currently provides around half the company's profit. Indeed, in the first half of financial year 200...
sMitsui Kinzokuwith its main office in Frankfort, KY. We are a technology company which was established in 2003 in order to create material solutions for the printed circuit industry. Our company’s strengths include expertise in copper foil manufacturing and resin technology supported by our R&D...
The present invention relates to a process for treating a surface of a copper foil for producing the copper foil for a printed circuit board in which a zinc layer, a copper layer and a chromate layer