1. PURPOSE. The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This determination is based on a measure of force applied to the die, the type of ...
1. PURPOSE. The purpose of this test is to verify that the markings will not become illegible on the component parts when subjected to solvents. The solvents will not cause deleterious, mechanical or electrical damage, or deterioration of the materials or finishes. 1.1 Formulation of ...
1.1.1 Load. The specimens under test and the fixtures holding those specimens during the test. Maximum load shall be determined by using the worst case load temperature with specific specimen loading. Monolithic (single block) loads used to simulate loading may not be appropriate when air...