MIL-STD-883E, METHOD 2011.11: STATIC ELECTRICAL DISCHARGE TESTING 1. Introduction MIL-STD-883E, Method 2011.11 is a standard used for testing the susceptibility of semiconductor devices to damage from electrostatic discharges. This method is used to evaluate the performance of semiconductor devices ...
MIL-STD-883 Method Number 3007 Low level output voltage MIL-STD-883 Method Number 3008 Breakdown voltage, input or output MIL-STD-883 Method Number 3009 Input current, low level MIL-STD-883 Method Number 3010 Input current, high level MIL-STD-883 Method Number 3011 Output short circuit curre...
Method No. Name of Method Purpose Equipment Needed 1004 Moisture Resistance Test To evaluate in an accelerated manner the resistance of component parts and constituents to the effects of high-humidity and heat conditions Uses temperature/humidity chambers capable of cycling conditions ...
MIL-STD-883ENOTICE 3ivTEST METHODSMETHOD NO. ENVIRONMENTAL TESTS1001100210031004.7 1005.8 100610071008.2 1009.8 1010.71011.9 1012.1 10131014.101015.9 10161017.2 1018.2 1019.5 1020.1 1021.2 10221023.2 1030.1 10311032.1 10331034Barometric pressure, reduced (altitude operation)ImmersionInsulation resistanceMoisture ...
METHOD 2012.7 1 June 1993 2 3.1.1.2 Stud-mounted and cylindrical axial lead devices. Stud-mounted and cylindrical axial lead devices, unless otherwise specified, shall have one view taken with the X-rays penetrating in the X direction as defined on figures 1 and ...
Source: http://.assistdocs -- Downloaded: 2011-11-13T08:33Z Check the source to verify that this is the current version before use. MIL-STD-883H iv TEST METHODS METHOD NO. ENVIRONMENTAL TESTS 1001 Barometric pressure, reduced (altitude operation) 1002 Immersion 1003 Insulation resist...
Table 4. Mil-Std-883 Method 5005 Group D (Package-Related) Tests (for all Classes of devices ) Disclaimer:The original document from which the information on this web page were taken, Mil-Std-883 Method 5005, contains many notes that do not appear on this page. Thus, people are advised...
MILSTD883E BOND STRENGTH (DESTRUCTIVE (mil std 883 e键的强度(破坏性的).pdf,MIL-STD-883E METHOD 2011.7 BOND STRENGTH (DESTRUCTIVE BOND PULL TEST) 1. PURPOSE. The purpose of this test is to measure bond strengths, evaluate bond strength distributions,
42 1 M 1032 Para 2.2 Replace "military" with "test method". 43 1 M 1033 Para 3.1 Replace "detail drawing" with "device specification or drawing". 44 * 5 M 2003 Para 4.5 Add criteria for Equipment manufacturer cleaning of carbonate/sulfate deposits. (G-12 Proposal) 45 * 5 M 2004 Par...
MIL-STD-883L:2019 DoD Microcircuits Test Method Standard(美国防部微电路测试方法标准 )- 完整英文电子版(28页).pdf 上传者:std86021时间:2022-11-28 塑封微电路( 塑封微电路(PEM)可靠性 虽然塑封微电路早在五十年代初期就出现在市 场上,且和气密性封装相比,在重量、尺寸、成本 及实用性方面有一系列的明显...