MI300 is AMD’s first shot at building a true data center/HPC-class APU, combining the best of AMD’s CPU and GPU technologies. As was laid out at the time, MI300 would be a disaggregated design, using multiple chiplets built on TSMC’s 5nm process, and using ...
AMD has announced the first data center CPU, the MI300A, has entered into volume production. This is the chip that powers El Capitan. The MI300A uses the same fundamental design and methodology as the MI300X but substitutes in three 5nm core compute die (CCD) with eight Zen 4 CPU cor...
Of course, yields become more challenging as die sizes grow, which is where advanced packaging of smaller chiplets becomes crucial. Multi-chip module offerings like AMD's MI300X and Intel's Ponte Vecchio already integrate dozens of tiles, with PVC having 47 tiles. TSMC envisions this ...
the FBI announced it would bereopening the Breonna Taylor case. The investigation seeks to fill the gaps of what happened May 13, 2020, when officers with a no-knock warrant entered Taylor’s home while she slept and shot the frontline worker to death. ...