图11压力传感器测试系统示意图 Fig.11Schematic diagram of pressure sensor 5.2 性能测试结果分析 压力传感器的压力测试量程为0~40 kPa,将压力测试间隔定为2.5 kPa,输入电压为5 V。在0,25和50 ℃ 3个不同温度下测试不同压力点的传感器输出,测试结果如图12所示。 图12压力传感器不同温度下的输出曲线 Fig.12Outpu...
Sensor alignment is a metric that warrants consideration during early stages of the design cycle while there is time to define the system architecture around the most efficient solution.
传感器与传感器中枢(sensor hub)在可穿戴设备乃至物联网应用中扮演的角色越来越重要,MEMS传感器的精确度决定了所收集信息的品质,而传感器中枢则是提取信息以开拓不同应用的关键。 Bosch Sensortec的Finkbeiner表示,目前传感器中枢领域现在分成三个阵营;在较高阶方案的部分,例如ST正采用其微控制器提供更精密的解决方案,而...
图3-5 光波导触觉传感器原理图Figure3-5 Schematic diagram of optical waveguide tactile sensor图3-5为光波导触觉传感器原理图,该系统力敏元件由硅橡胶制成,在其两侧分别制 59、作圆柱触头和圆锥触头阵列,使得每个圆柱触头下面分布五个圆锥触头。在硅橡胶垫与光波导之间有一极薄的空气隔离层,在光波导另一面与...
Functional Block Diagram Product Features • Supply voltage: 3V~5.5V • Operating temperature range: -20℃~70℃ • High accuracy in full temperature range, and customizable pressure range - NSPDS5:±500Pa~±250kPa,±1%F.S. • Optional output mode (analog /I2C digital output) ...
Functional Block Diagram Product Features • Customizable range: -10kPa ~ +10kPa • Wide temperature range: 0℃~70℃ • The comprehensive accuracy in the full temperature range is better than ± 2.5% • Analog voltage /I2C digital output/frequency output • High stability, 100% calibr...
L3G3200D MEMS motion sensor: three-axis digital output gyroscope Preliminary data Features ■ Wide supply voltage, 2.4 V to 3.6 V ■ Wide extended operating temperature (-40 °C to 85 °C) ■ Low voltage compatible IOs, 1.8 V ■ Low power consumption ■ Embedded power-down ■ Sleep mode...
LIS302DL MEMS motion sensor 3-axis - ± 2g/± 8g smart digital output "piccolo" accelerometer Feature ■ 2.16 V to 3.6 V supply voltage ■ 1.8 V compatible IOs ■ <1 mW power consumption ■± 2g/± 8g dynamically selectable full-scale ■ I2C/SPI digital output interface ■ Programmable...
* Etch rate diagram of silicon MEMS Device Simulator Simulation of thermal actuator Simulation of piezoresistive sensor MEMS CAD MEMS 设计与优化/CMOS MEMS 设计与优化 基于标准工艺的 MEMS 设计/商用 MEMS 设计软件的集成 特定 MEMS 设计工具开发 版图设计/器件级模拟/工艺模拟/系统模拟 测试结构设计/建库 *...
Figure 6Cross-section diagram of a traditional top port MEMS microphone The smaller air volume in the back chamber of traditional top port MEMS microphones makes it more difficult for the membrane to move, which hurts the sensitivity of the sensor and leads to a lower SNR. In addition, the ...