Full 6-sided post testing die inspection Micro-scale defect detection down to 50 µm Vision assisted accurate die placement Completed unit-level traceability from bowl or tray input to tape & reel output Pre-
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This kind micromirror has shown great applications in optical coherence tomography, microscopy and micro-investment equipment. First of all, the domestic and foreign research background and development of the form of electro-thermal drive MEMS micromirror. Then we make mechanical analysis for the ...
The device layer is structured by a full layer thickness etch (and potentially one or several partial layer thickness etches) to form waveguiding structures, and the buried oxide prevents optical power leakage to the substrate. Several optimized doping levels in the device layer allow for modulator...
Full size image Other transduction mechanisms Although unstrained pristine graphene does not exhibit piezoelectric properties, recent reports suggest that graphene exhibits piezoelectric behavior in certain configurations, such as applying strain or engineering graphene; this behavior can be caused by the charg...
The high frequency response of the sensor needs to be extended, ideally up to 20 kHz to capture the full tonal range of the instrument. MEMS accelerometer technology has clear potential for acoustic pickup applications in musical instruments, especially in live performances where acoustic feedback ...
(2–3 μm). The device layer is structured by a full layer thickness etch (and potentially one or several partial layer thickness etches) to form waveguiding structures, and the buried oxide prevents optical power leakage to the substrate. Several optimized doping levels in the device layer ...
Full size image Other transduction mechanisms Although unstrained pristine graphene does not exhibit piezoelectric properties, recent reports suggest that graphene exhibits piezoelectric behavior in certain configurations, such as applying strain or engineering graphene; this behavior can be caused by the charg...
David Binion,Xiaolin Chen.Coupled electronthermal-mechanical analysis forMEMS via model order reduction.Finite Elements in Analysis and Design. 2010D. Binion, X. Chen, "Coupled electrothermalmechanical analysis for MEMS via model order reduction", in Finite Elements in Analysis and Design, vol. 46...
Full size image Li et al.50enhanced the stress concentration effect using a crossbeam film and introduced a high-sensitivity structure by integrating the film with an annular groove, as illustrated in Fig.1d, e. In this configuration, the crossbeam serves as a supporting rib, preventing undue ...