W. H.; Dollhopf, W.; Blankenhorn, K.; Mayr, P. U. On the pressure dependence of the heat of fusion and melting temperature of indium. Thermochim. Acta 1996, 273, 17-24.Ho¨hne, G. W. H., Dollhopf, W., Blankenhorn, K. & Mayr, P. U. On the pressure dependence of the ...
W. H.; Dollhopf, W.; Blankenhorn, K.; Mayr, P. U. On the pressure dependence of the heat of fusion and melting temperature of indium. Thermochim. Acta 1996, 273, 17-24.Ho¨hne, G. W. H., Dollhopf, W., Blankenhorn, K. & Mayr, P. U. On the pressure dependence of the ...
Effect of copper addition on the thermal contraction of indium melt clusters The structure of In-1%Cu and In-5%Cu (mass fraction) alloy melts were studied at different temperatures above liquidus by using a high-temperature X-ray di... CHENG,Sujuan,WANG,... - 《Rare Metals》 被引量: 0...
“melting temperature"的最常见翻译: 熔点, 熔解温度, 凝点.上下文翻译: Some formulas are more accurate in predicting melting temperatures of DNA duplexes. ↔ 某些公式更精確地預測DNA雙鏈體的解鏈溫度。
Reversing melting and crystallization of indium as a function of temperature modulation, Thermochim. Acta 2000, 364, 181.R. Androsch and B. Wunderlich.Reversing melting and crystallization of indium as a function of temperature modulation*1, Thermochim.Acta. 2000...
Crystal melting behavior of indium and isotactic polypropylene has been examined by differential scanning calorimetry of heat flux type in terms of the heating rate, β, dependence. The melting shows the dependence characterized by a power, z, of the shift in peak temperature in proportion to β...
For crystal growth and surface phase transitions, we discovered a simple rule in the relationship between surface structure and temperature. This rule states that changes in crystal growth modes and those in surface structures occur at temperatures that are simple fractions, such as , and , of the...
The instrument was calibrated with high-purity standards (indium and cyclohexane) for melting temperature and heat of fusion. Heating rates of 10, 20, 30 and 40 1C/min were used whenever needed. Relatively small samples (B5 mg) were used to minimize the thermal conductivity of the polymer; ...
The Melting point of solder is the temperature at which the solder changes its state from solid to liquid. The typical melting point of the general solder is in the range of 90 to 450 °C (190 to 840 °F | 360 to 720 K). Solder is an easily fusible adhesive metallic material melts...
The zone-melting temperature of YBaCuO tapes were decreased under 945□ by doping Ag and PbO in YBaCuO films, which made zone-melting process possible with Ag substrate not melted. 通过掺杂Ag和PbO的方法降低YBaCuO的区熔温度到945℃以下,从而能够在金属Ag基底上进行区域熔炼,获得有织构的超导带材。