Samsung Exynos 1380 vs MediaTek Dimensity 6100 Plus vs MediaTek Dimensity 6020 vs MediaTek Helio G85 vs Samsung Exynos 1380 vs MediaTek Dimensity 7050 vs MediaTek Dimensity 6020 vs MediaTek Dimensity 700 vs Samsung Exynos 1380 vs Qualcomm Snapdragon 7 Gen 3 ...
vs MediaTek Dimensity 6100 Plus vs Samsung Exynos 1380 vs MediaTek Dimensity 6080 vs Qualcomm Snapdragon 7s Gen 2 vs MediaTek Dimensity 7200 Ultra vs Qualcomm Snapdragon 7s Gen 2 Price comparison MediaTek Dimensity 7050 Qualcomm Snapdragon 8 Gen 2 ...
相比之下，Snapdragon 8 Gen 3的功耗为5.8W，而Dimensity 9300的功耗为5.4W，Dimensity 9400的功耗优势达到了18.5%至24%。散热性能：Dimensity 9400保持冷静 在散热方面，Dimensity 9400同样表现出色。在同样的游戏测试中，Dimensity 9400的温度仅为43.2°C，远低于Snapdragon 8 Gen 3和Dimensity 9300+设备的...
MediaTek Dimensity 8020 2 - 2.6 GHz 8 / 8 Cortex-A78 / A55 MediaTek Dimensity 7300 2 - 2.5 GHz 8 / 8 Cortex-A78 / A55 MediaTek Dimensity 1100 2 - 2.6 GHz 8 / 8 Cortex-A78 / A55 MediaTek Dimensity 7050 2 - 2.6 GHz 8 / 8 Cortex-A78 / A55 MediaTek Dimensity 7030 ...
MediaTek Dimensity 7200 MediaTek Dimensity 7050 MediaTek Dimensity 7030 MediaTek Dimensity 7025 MediaTek Dimensity 7020 MediaTek Dimensity 7350 New MediaTek Dimensity 7300X New MediaTek Dimensity 7300 Dimensity 6000 Family The MediaTek Dimensity 6000 family powers highly desirable 5G entry-points. Supp...
值得一提的是，天玑8400还搭载了MediaTek天玑AI智能体化引擎（Dimensity Agentic AI Engine），这一技术曾率先在天玑9400旗舰芯片中亮相。该引擎能够助力开发者打造出更加智能、个性化的AI应用，将传统的AI应用程序升级为更加先进的智能体化AI应用。这些新的应用能够预测用户需求，并提供定制化的智能服务，从而推动移动设备...
MediaTek Dimensity 1000+ 0.99 -17% Samsung Exynos 990 0.999 -16% Qualcomm Snapdragon 778G 5G 1.035 -13% HiSilicon Kirin 990 1.067 -10% Qualcomm Snapdragon 780G 5G 1.074 -9% HiSilicon Kirin 990 5G 1.102 -7% Qualcomm Snapdragon 870 5G 1.142 -4% Qualcomm Snapdragon 865+ (Plus) ...
新赛季上分太艰难?游戏内画质不给力?那就快来体验 MediaTek 联合 vivo 在 X90 及 X90 Pro 终端上带来的全新黑科技——游戏自适应调控技术和硬件光线追踪技术。让你尽享稳定流畅、画质绝美的全新游戏体验! 新赛季上分太艰难?游戏内画质不给力?那就快来体验 MediaTek 联合 vivo 在 X90 及 X90 Pro 终端上带来的...
MediaTek Dimensity 9500规格泄露 据PhoneArena报道,MediaTek即将推出的Dimensity 9500处理器的规格被泄露,这款芯片可能成为高通的强劲对手。该消息于2024年12月27日发布,引发了科技界的广泛关注。 先进的制造工艺和核心配置 Dimensity 9500预计将采用台积电(TSMC)的N3P先进制造工艺,这将使其在性能和能效方面都有显著提升...
Samsung Exynos 1380 vs MediaTek Dimensity 8050 vs Qualcomm Snapdragon 888 vs Mediatek Dimensity 7200 vs Qualcomm Snapdragon 7 Gen 3 vs MediaTek Dimensity 8050 vs Mediatek Helio G99 vs Mediatek Dimensity 7200 vs Qualcomm Snapdragon 6 Gen 1 ...