The resulting mechanical integrated circuit materials perform higher-level arithmetic, number comparison, and decode binary data to visual representations. We exemplify two methods to automate the design on the basis of canonical Boolean functions and individual gate-switching assemblies. We also increase ...
Mechanical integrated circuit materials Article 24 August 2022 Programmable responsive metamaterials for mechanical computing and robotics Article 27 August 2024 A mechanical metamaterial with reprogrammable logical functions Article Open access 13 December 2021 Introduction...
CMP has come a long way from its beginnings as just a simple method for polishing oxide materials to a smooth, finished surface. Today, chemical-mechanical planarization plays a critical role in contemporary integrated circuit processing, and it will still be needed for at least the next ten ye...
- 《Acs Applied Materials & Interfaces》 被引量: 0发表: 2019年 Integrated blocking layers for hybrid organic solar cells In hybrid organic solar cells a blocking layer between transparent electrode and nanocrystalline titania particles is essential to prevent short-circuiting... M Memesa,S Weber,...
A novel fully integrated dynamic thermal management circuit for system-on-chip design is proposed. Instead of worst-case thermal management used in convent... KL Edwards - 《Materials & Design》 被引量: 400发表: 2003年 Materials Selection in Mechanical Design A novel fully integrated dynamic ther...
Absorption and outgassing—NASA's outgassing data for selected spacecraft materials (http://outgassing.nasa.gov); an example of following this direction might involve using conformal coating in manufacturing and assembling circuit boards and controlling the water vapor exchange and outgassing with an alc...
Integrated circuit (IC) and microelectronic packaging technologies are moving towards high density, speed/frequency, heat dissipation, and reliability, while retaining or reducing their packaging sizes/thicknesses. To keep pace with such a development trend, improvements in the mechanical, electrical, and...
Since the invention of the first integrated circuit in 1958, chemistry and materials have played a critical role in semiconductor process technologies, which has led to an exponential growth of transistors packed into circuits. Decades ago, Gordon Moore posited there would be a doubling of component...
Functional Micro-Dispensers based on Micro-Electro-Mechanical-Systems (MEMS) integrated with fabrics as functional materials to protect humans from mosquit... Functional Micro-Dispensers (FMDs) based on Micro-Electro-Mechanical-Systems (MEMS) were designed to deliver spatial repellents that reduce the ...
Under such temperatures, moisture absorbed by polymer materials evaporates, generating high internal vapor pressures in the voids. Interface delamination may be caused by the combined effect of the thermomechanical stress, hygromechanical stress and vapor pressure. The main objective of this paper is ...