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However, higher switching frequency brings more switching loss, making the design less efficient and produce more heat. The switching frequency is also limited by the minimum on time of the integrated power switch, the input voltage, the output voltage, and the frequency shift limitation as ...
The internal die temperature (TJ) is a function of the ambient temperature, the power loss and the effective thermal resistance, RθJA of the device and PCB combination. The maximum internal die temperature for the LMR36006 must be limited to 150°C. This establishes a limit on the maximum...
The internal die temperature (TJ) is a function of the ambient temperature, the power loss, and the effective thermal resistance, RθJA, of the device and PCB combination. The maximum internal die temperature for the LMR33610 must be limited to 125°C. This establishes a limit on the ...
However, higher switching frequency brings more switching loss, making the solution less efficient and produce more heat. The switching frequency is also limited by the minimum on-time of the integrated power switch, the input voltage, the output voltage, and the frequency shift limitation as ...
The internal die temperature (TJ) is a function of the ambient temperature, the power loss, and the effective thermal resistance, RθJA, of the device and PCB combination. The maximum internal die temperature for the LMR50410-Q1 must be limited to 150°C. This establishes a limit on the ...
The internal die temperature (TJ) is a function of the ambient temperature, the power loss and the effective thermal resistance, RθJA of the device and PCB combination. The maximum internal die temperature for the LMR36006 must be limited to 150°C. This establishes a limit on the maximum...