Power Electronics TechnologyValenzuela, J., Jasinkski, T, and Sheikh, Z., 2005, "Liquid Cooling for High-Power Electronics," Power Electronics Technology, February 2005, pp. 50-56.Valenzuela, J.; Jasinskia, T.; Sheikh, Z. 2005. Liquid cooling for high-power electronics, Power Electronics...
Transform Thermal Management in Your High-Power Electronics JetCool’s direct-to-chip liquid cooling modules use arrays of small fluid jets that precisely target hot spots on processors,transforming high-power electronic cooling performance at the chip or device level.Our patented microconvective cooling...
CW RF Cavity Design for High-Average-Current Photoinjector for High Power FEL S. Kurennoy, ... J. Rathke, in Free Electron Lasers 2002, 2003 3 Material and Cooling Options The materials considered are copper, Glidcop, and beryllium. The last one is especially promising with liquid-nitrogen...
power conversion liquid cooling, inverter cold plates, and low profile telematics cooling. industrial high power density industrial equipment requires rugged, high performance liquid cooling systems. power electronics cooling, igbt liquid cooling, inverter cooling, igbt direct liquid cold plates, semiconducto...
Enter PC liquid cooling, an alternative to the trusty old fan. Liquid provides some unique advantages to high-performance computers that deliver speed, power, and graphics and require a more advanced cooling solution. So, what is better for your PC, fan vs water cooling? And how does wate...
Introduction of Bare-Die Jet Cooling in Package With the rising demand for more powerful, efficient, high-performance computation (HPC) systems, power densities of devices have increased dramatically. To cope with the increasing heat flux challenge for future data center servers beyond 1 kW/cm2, ...
Non-dielectric liquid coolants are often used for cooling electronics because of their superior thermal properties, as compared with the dielectric coolants. Non-dielectric coolants are normally water-based solutions. Therefore, they possess a very high specific heat and thermal conductivity [9]. De...
The structure chosen and the power density achieved make it obvious that such a design is meant for a high-power application. Applications that already feature liquid cooling and demand high power throughput can especially benefit from an insulated power semi-conductor arrangement. ...
A cooling system is presented. The system includes a cooling circuit and at least one electronic component coupled to a surface. One or more heat dissipation structures are in therm
a feed channel formed in the base for carrying fluid into the cooling well; a drain channel formed in the base for carrying cooling fluid away from the cooling well; cooling well inlets and outlets formed in the cooling well and in communication with the feed channel and drain channels, resp...