VLSI devicesFor the acceptance of X-ray lithography in an industrial environment not only the high resolution and accuracy capabilities have to be demonstrated, but also the compability of the X-ray related pro
I really enjoy wide range of sciences in computer such as Very-large-scale integration (VLSI) and I reseached about new technologies of that like NoC (network on chips) and also my special favor is about usage of nanotechnology for reducing the size of transistors. His main research ...
machine learning, and the cloud. Technology embedded in the wearable device leverages the best-in-class performance, power consumption, and broad feature integration capability of GF’s differentiated 22FDX platform, which is the solution of choice for designers and innovators working in Internet of ...
Tools and Architectures Know-how Multilevel platforms for fault simulation and robustness automatic insertion at several abstraction levels; 3D integration solutio... L Anghel,M Benabdenbi,N Zergainoh,... 被引量: 0发表: 2015年 Towards Analysis of the Radiation Sensitivity of Digital Designs at ...
The present translator circuit provides flexibility in that it can be configured for one of two standard formats, and can be used in very large scale integration (VLSI) applications in which the functionality of the circuit is determined by the connector options. It can be used in high-speed ...
Very Large-Scale IntegrationThis paper provides an outline of system-level partitioning in very large-scale integration (VLSI) design. The objective of which is to optimize system performance while minimizing the number of circuits required. The major constraints in this phase include: constant board...
But because of breakthroughs in fabrication, some of these ICs are now suitable for use in more complicated VLSI designs, creating new trade-off issues when selecting ICs. Digital GaAs products can successfully compete with silicon ECL on the issues of power consumption, I/O compatibility, ...
The technological rules and design standards have become much more complicated with the increase in the degree of integration of microelectronic systems and the reduction of the technological dimensions of the basic elements to 32 nm and smaller. There are several thousand design restrictions for ...
This includes Wafer Scale Integration (Level 0), hybrid assembly of bare chips in multichip modules (Level 1.5), printed wiring board (PWB) assembly, including surface mount (Level 2), and higher levels (connectors, mother boards, and cables). Furthermore, high-performance digital VLSI logic ...
Jezequel, "From Parallelism Levels to a Multi-ASIP Architecture for Turbo Decoding," IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 17, pp. 92-102, Jan 2009.O. Muller, A. Baghdadi, and M. Jezequel, "From parallelism levels to a multi-asip architecture for turbo ...