11.Design the EMI filter.11.设计EMI滤波器。 12.Lay out the PCB.12.为PCB布线。 The flyback stage design is carried out at the full brightness (full load) point.在全亮度(满载)点进行反激阶段设计。为了达到最佳的解决方案,设计的过程可能需要反复几次。尤其是EMI滤波器,是至关重要的,因为只有很小...
PCBA, PCBAAassembly: SMT & PTH & BGA PCBA and enclosure design Components sourcing and purchasing Quick prototyping Plastic injection molding Metal sheet stamping Final assembly Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) Custom clearance for material importing and pr...
Component Placement: the right component placement is what it takes to design an efficient LED circuit board. Placing the right component at the right spot is crucial in PCB design. Along with LEDs, an LED PCB contains other components such as connectors, resistors, and thermistors, which need ...
5). Two PCB with powerful wattage. 6). High quality LED chip from TaiWan. 7). Isolated driver with top quality and very safe. 4, LED Cooler Light three types PC Cover 1). Frosted cover: Can acheive soft light, no harm to your eyes 2)....
*Versatilemountingonp.cboardorpanel.(通用的装备在PCB板上或面板上) *I.Ccompatible/lowcurrentrequirement.(与IC配套使用/低电流需求) PackageDimensions(产品外观尺寸)Unit:mm SelectionGuide(选择指南) PartNumber(产品型号) Lenscolor(胶体 颜色) Chip(使用芯片) ...
11. PCB soldering temperature curve can be displayed based on real-time measurement. 12. Lightweight, miniaturization, professional industrial design, flexible application site, more user-friendly. 13. Energy saving, low power consumption, low power supply requirements, the ordi...
This Infineon Reference Design Guide describes a detailed implementation of an automotive front light high beam / low beam combination using the flexible multitopoly DC-DC controller TLD5099EP of the LITIX™ Power family in current controlled buck-boost SEPIC configuration. ...
for panel with light-weight sub-frame structure design6. Nanotechnology and unique positioning system, making the installation and dismantlement in one step;1.Most of our product use material as follow: MBI 5153 IC or ICN2153 Driver IC g-energy power supply 4layer pcb 1.6-2.0mm...
PCB two-layer circuit design, TG150KB sheet material thickness 1.6MM, sheet material and copper thickness meet industry standards, IC adopts Chipone North ICND2038S high-brush double buffer chip equipped with RU5958DSP row decoding chip, which effectively suppresses...
1.Rear service design. 2.Wide range viewing angle/great uniformity , contract ratio and screen flatness. 3.Anti-UV module mask, Anti-Oxidation module frame with protection from deformation. 4.Energy-saving 29% by using high efficiency IC driver, high brightness ...