PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a reinforced composite material as a matrix resin of a reinforced composite material, wherein both of heat resistance and toughness can be attained at high levels and can improve prepreg handling properties.高坂 崇...
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a composite material having a low viscosity that can be impregnated into reinforced fibers at room temperature and having a long pot-life which is used for filament winding, and to provide a composite material which is molded using...
aCarbon fibers with a nominal diameter of 7 µ m (Teijin Fibers Ltd.), oxidized (CFO), epoxy sized (CFE) and untreated unsized (CF) have been used to investigate the influence of ultrasound treatment on mechanical properties of epoxy resin composites 碳纤维与7 µ m (Teijin有限公司纤维...
In order to overcome the problems described above, the present inventors have found that by using a thermosetting resin composition containing a polyimide resin, a phenol resin, and an epoxy resin as essential components, the epoxy resin and the phenol resin being mixed at a predetermined ratio ...
ATTRITION RESISTANT, CONTROLLED RELEASE FERTILISER COMPRISING PARTICULATE FERTILISER CONTAINING AT LEAST ONE WATER-SOLUBLE NUTRIENT SURROUNDED BY A PLURALITY OF COATINGS, ONE BEING AN AMINE CURED EPOXY RESIN 来自 掌桥科研 喜欢 0 阅读量: 6 申请(专利)号: NZ19950280498 申请日期: 1995-11-20 公开/...
(e.g. circuit boards based on epoxy resin) or are used as covering materials (e.g. as a passivation layer on an IC made from silicon oxide and/or silicon nitride or an IC housing made from filled epoxy resin, i.e. mold compound) are also not “insulating layers” in the context ...
The gap7may be also filled with additional insulator (as e.g. epoxy resin or Teflon) in order to confine spreading of the metallic solder of the connection layer within the gap and thus to avoid possibility of short-circuiting of the electrically conducting substrates3aand3c. ...
The epoxy resin which at least possesses the epoxy basis 2 inside the fire-resistant epoxy resin constituent, andPROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent flame retardant properties and reliability and being suitable for sealing of semiconductors.井上 義文...
PROBLEM TO BE SOLVED: To provide a prepreg for a printed wiring board having high connection reliability to a mounting component because of a low coefficient of thermal expansion and being excellent in heat resistance.島岡 伸治尾瀬 昌久合津 周治加藤 亮...
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a composite material having a low viscosity that can be impregnated into reinforced fibers at room temperature and having a long pot-life which is used for filament winding, and to provide a composite material which is molded ...