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Microstructure evolution of Ag–8Au–3Pd alloy wire during electromigration. Mater. Charact. 2015, 110, 44–51. [CrossRef] 23. Chao, B.; Chae, S.-H.; Zhang, X.; Lu, K.-H.; Im, J.; Ho, P.S. Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic ...