The present invention relates to a lead-free solder alloy composition and a method for producing a lead-free solder alloy, wherein the lead-free solder alloy composition of the present invention comprises lead-free solder Sn-(0.1-2) wt% Cu, Sn-(0.5-5) Ceramic powder is added to wt% Ag...
Lead Free Solder and Composition Differ from Leaded Solder Composition. Tin (Sn) is Present in Both Lead Free and Leaded Solder but Lead (Pb) is Not Present
been studied in two test vehicles under simultaneous temperature and vibration. Board assemblies have been subjected to two acceleration levels of 10g and 14g over temperature range of 25 Celsius to 125 Celsius. Resistance of the components has been measured during the test till failure. The board...
The lead-free solder composition comprises an alloy of at least 50 wt. % tin and 7-30 wt. % zinc. An effective amount of silver is added to increase the ductility of the resultant alloy at least 25% over the ductility of the binary eutectic tin-zinc alloy. In a further embodiment, ...
Lead Free Solder Sac305 Alloy: Our company provides Tin Lead Free Solder Bar with a variety of alloy composition , content and size of the diameter of pharmaceutical different specifications tin for customer choice. Introduction to Tin Solder Products Tin solder is a widely used material in...
A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contain... ...
NameLead-free solder bar Alloy compositionSn-0.3Ag-0.7Cu Package25pcs/box,25kg/carton MaterialTin/Lead Melting point245-266ºC Product brandZhongShi Soldering methodManual dip tin & wave soldering tin UseSuitable for USB, wire solder products are ...
Alloy Sn99.3Cu0.7 Package 1kg Melting point 227ºC Flux No Lead-free solder bar Specification Name Lead-free solder bar Material Tin/Lead Melting point 245-266ºC Soldering method Manual dip tin & wave soldering tin Use Suitable for USB, wire solder products are also suitable fo...
Lead-free bismuth free tin alloy solder composition A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 93-98% tin, 1.5-3.5% silver, 0.2-2.0% copper, and 0.2-2.0% antimony......
A solder alloy comprises 38.0-42.0 wt % bismuth (Bi), 0.01-2 wt % of at least one further element chosen from the group of manganese (Mn), antimony (Sb) and copper (Cu), the balance being tin (Sn), and is at least substantially free of nickel (Ni), and further preferably substant...