In the above example, you can see the wide shiny area around the hole to ensure good solder contact between the part pin and the circuit board trace. Soldering goes faster as well, since it is easier to target the larger pad with the soldering iron tip. Solder Mask Issue A nice feature...
To reduce crosstalk from lines on the layer above, the ground plane should be run over a larger section of the same layer. The asymmetrical and central placement of the ground planes and power planes is best for your PCB. As a result, bending loads are better distributed and easier to ...
The next design stage is the pre-layout stage; in this stage, the BOM from the schematic is validated for long lead time components and obsolete components. During the validation process, the manufacturing part numbers (MPN) and vendor part numbers are verified. During this stage, thestack-upd...
the area of the red emitter102R is greater than the area of the green emitter102G, which in turn is greater than the area of the blue emitter102B. In one possible implementation, the area of the red emitter102R is about 1.5 times the area of the ...
*H 2 Antenna Design and RF Layout Guidelines 2 Antenna Basics An antenna is basically a conductor exposed in space. If the length of the conductor is a certain ratio or multiple of the wavelength of the signal1, it becomes an antenna. This condition is called "resonance"...
Keeping the solder mask openings separate is important to prevent assembly problems during reflow. The recommended SMA/SMB footprint will vary based on vendor, however the package is standardized and will allow for the layout shown in Figure 3. The landing pads above will allow for reliable ...
The traces on one layer can be connected to the other layer with avia. A via is a copper plated hole in the PCB that electrically connects the top layer to the bottom layer. You can also connect top and bottom traces at a component’s through hole: ...
Figure 4. A flyback regulator maintains regulation for inputs that range above and below the output voltage. Because currents at the input and the output are both discontinuous, making conducted emissions more difficult to control, noise from this converter is generally worse than that of a step...
An integrated circuit includes a substrate including active circuitry fabricated on the substrate and a cross-point memory array formed above the substrate. The cross-point memory array can include conductive array lines arranged in different directions, and re-writable memory cells. Further, the integ...
In the sample constraint group above, this is done using layers derived in the layerDefinitions section. For example, layerDefinitions( techDerivedLayers( ;( DerivedLayerName ;( --- ( noOverlapLayer1 ( noOverlapLayer2 Layer# --- 10004 10009 Composition --- ( POLY 'and DIFF ) ( POLY 'a...