The article reports that Intel's latest chip advances could take on new rivals besides Advanced Micro Devices Inc. (AMD). In a technical conference in San Francisco, California, it presented Larrabee which could be used for complex scientific calculations and could compete with high-end graphics ...
AVX-512 is being adapted from Intel’s latest supercomputing chip, the 72-core Xeon Phi, which is code-named Knights Landing. Another feature is on-chip support for Intel OmniPath, a proprietary high-speed interconnect that links servers, storage, networking, and other datacenter hardware. ...
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but as the reviews now drop, the cost of such raw power is quite steep. Not only does this chip demand a lot from your wallet — it demands even more from your power supply and cooling.
Intel’s rumored split between TSMC and Broadcom could reshape the AI chip race NASA boosts asteroid 2024 YR4’s impact odds to 3.1% for 2032 Fire at SPS Technologies facility highlights safety challenges, spurs R&D questions Microsoft’s Majorana 1 aims to accelerate real-world quantum ...
Americas' Chip Suppliers Continue to Dominate R&D Spending Jul. 21, 2022 Are Micron and the Taiwanese Semi Suppliers the Canaries in the Coal Mine? Jul. 14, 2022 Fabless Suppliers Hold Record 34.8% Share of Global IC Sales Jul. 08, 2022 Top Five MPU Suppliers Expand Share of Sales ...
Intel this week is rolling out five different SKUS of the chip, with core counts ranging from 32 to 56. With 64 GB of high bandwidth in-package memory, the Xeon Max CPUs will provide enough memory capacity to fit most common HPC workloads -- without leveraging DDR memory. ...
Silicon Creations' PLL Technology Contributes to the First 7nm Mass Production Mining Chip Feb. 13, 2019 Silicon Creations Relies on Silvaco's Custom Design Flow for New Advanced FinFET Designs Jan. 28, 2019 Silicon Creations' Fractional-N PLL Technology Leveraged at Israel's Bar-Ilan Univ...
Intel’s rumored split between TSMC and Broadcom could reshape the AI chip race Arteris FlexGen achieves up to 10x reduction in NoC design iterations This week in AI research: OpenAI eyes $340B valuation, partners with national labs Aerospace See More > U.S. Space Force releases first public...
Microsoft will be bringing two foldable dual-screen mobile devices to consumers in 2020 thanks to a new chip technology created by Intel. Microsoft made a handful of product announcements at its Microsoft Event on October 2, including new additions to the the Surface Pro and Surface Laptop famili...