一、激光辅助键合(LAB)工艺技术的介绍 激光辅助键合,英文全称:LaserAssistedBonding,简称LAB,是应用半导体集成电路后道封装制程领域的一项技术,是指将激光束照射到芯粒或需要焊接的器件上使芯粒及器件数秒内由室温升至焊接温度,将其焊接在基板、interposer或堆叠的另外一个芯粒上。该技术可用于对速度、精度和局部非常小...
炬光科技董秘:尊敬的投资者您好,激光辅助键合(LaserAssistedBonding,简称LAB),是应用半导体集成电路后道封装制程领域的一项技术,是指将激光束照射到芯粒或需要焊接的器件上使芯粒及器件数秒内由室温升至焊接温度,将其焊接在基板、interposer或堆叠的另外一个芯粒上。该技术可用于对速度、精度和局部非常小区域的精确加热...
Foster, A wafer-level packaging approach for MEMS & related microsystems using selective laser-assisted bonding (LAB). Proceedings of 55th Electronic Components & Technology Conference, 2005. 1&2: p. 1099-1102.Mohan, A., Neal, C.B.O., Malshe, A.P., Foster, R.B.: A wafer-level ...
Fabrication of LOCs has its origin in microelectronics and silicon micromachining techniques, dating back to the early 1950s [14,15,16]. Micro-nanoscale structures of high precision can be obtained utilizing techniques of photolithography and soft-lithography, chemical etching, micromilling, bonding, o...
Surfaces can be modified when desired surface properties are needed. Changing wettability can boost or stifle capillary liquid flow37,38. Surface modifications also facilitate bonding39,40,41, allowing microfluidic chips to be sealed more effectively. Plasma treatment, UV irradiation42, and laser source...
The novel microfabrication methods have been applied for the realization of practical polymer lab chips such as (a) sample preparation for matrix-assisted laser desorption/ionization mass spectrometry (MALDI-MS) and (b) on-chip capillary electrochromatography with electrochemical detection for on-site ...
A solvent vapour thermoplastic bonding process is reported which provides high-strength bonding of PMMA over a large area for multi-channel and multi-layer microfluidic devices with shallow high-resolution channel features. The bond process utilises a low-temperature vacuum thermal fusion step with pri...
Molten wax, irradiated by laser, bursts into the main channel and solidifies, which in turn blocks the channel. In a normally closed valve, the ferrowax plug is located between two chambers and blocks the fluid flow. After applying the laser power, molten wax flows to the chamber and ...
” Journal of Assisted Reproduction and Genetics (1993): Vol. 10, No. 6, 427. 4) Clement-Sengewald, A, Buchholz, T, Schutze, K, et al. “Noncontact, laser-mediated extraction of polar bodies for prefertilization genetic diagnosis.” J Assist Reprod Genet (2002): 19:183. 5) Err...
Ultrasonic welding is a rapid, promising bonding method for the bonding of polymer chips; yet its use is still limited. We present two lab-on-a-chip applications where ultrasonic welding can be preferably applied: (1) self-aligned gapless bonding of a two-part chip with a tolerance of 50 ...