KB-6167F Tg170 Data
KB-6167F Tg170 Data
High Tg (DSC) value of 170-180°C High Decomposition Temperature: >340°C Low moisture absorption Lead-free assembly compatiblity CAF-Enhanced Low Z-axis expansion Test method used for Tg: DSC; Dk and Df @ 1GHz; Td: TGA Resources
KB-6167F KB-6067F Processing Guide
KB-6167F Tg170 Data