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KUKA SERVO MOTOR 1FK6100-8AF91-1ZZ9-Z S09 Kuka Siemens EN60034 1FK7060-5AF71-1YY3-Z Sychronous Sinamics Motor ( ) Kuka Type KC1 00104262 Robot Interface Controller 19-30V WOW Kulicke and Soffa 1474fp (1474) Wire Bonder SN: 2391 Kulicke and Soffa 1474fp (1474) Wire Bonder SN: ...
DkYoung'sModules(Gpa)CTE(ppm/¡CC)SiO2 4.2732.7 FSG 3.4~3.7603 Lk 2.7~3.41019 ELk 2.2~2.5<10>20 Cu/low-kisthewell-knownsolutiontoreducesignaldelayandimproveelectricalperformanceforadvancedIC.ButthemechanicalpropertiesofCu/low-karepoorerthanAl/Sioxidecombination.Thisstudyinvestigatestheimpa...
Panasonic FB30T Wire Bonder Parts SMC Cylinder CDQSB12 Vexta PK243A1 Motor OT-SMC054115: MXS12-30AS SMC Variantenzylinder MXS12 OT- SMC070005: VS4110-025DL SMC 5/2-Wege-Elektromagnetventil NEU Opal SMC/M Vacuum Board, EA 70317875000 Onset S-SMC-M005, EC-5 Soil Moisture Smart Sensor ...
0.2-2100 kHz Measuring and switching remote control panel P-326-4 0.250" x 25" Vamco Servo Feeder Model: CFS-30II S/N: HDC42530PVPCL13 0.5% Current & Voltage transformers calibrator meter K507 an-g Agilent 00084 Accu-sort Bar code scanning kit 0010-03338 ASSY HEATER 8" SR OSCR WXZ ...
Provided are a wire bonder and a wire bonding method capable of preventing short circuits in a semiconductor package due to wires cut in a wire bonding process during a semiconductor packaging process. To this end, the present invention provides a separate wire tail cutting portion on the window...
10、 bonding process.,Test Vehicle:,Bond time: 15ms,USG current: 5062mA,Bond force: 1115mA,Gold wire : S xx 0.9mils,Capillary : M xx,Wire Bonder: K xx,Pad pitch: 60um,Pad open: 52*61um,Die size: 8.0 * 8.0mm,Package: BGA 37.5 * 37.5 552 I/O,1st bond graphical optimization:...
The capillary design selection guide is always based on specific device & package configuration, wire type, and wire bonder. The selection of capillary part number process is simplified as follows: Capillary Tip The selection of capillary tip design is determined by the device and metallization, bon...
说明: Description High Speed Fully Automatic Fine Wire Wedge Bonder The Thin Wire Wedge Wedge Bonder Bondjet BJ820 is the latest development of Hesse's wedge bonding innovation, responding to all wire bonding challenges on a single platform for a variety of applications such as RF and microwave...
4 CONDUCTOR I/O AWG CABLE WIRE q 4 Engis HYPREZ lapping systems. 2 units turn on and the wheel rotates. 4 Fluke Networks OptiView Ethernet Pro OPV-PRO Network Analyzers 4 Horiba Stec LF-410A-EVD Liquid MFC, TEOS, 3.0 g/min, Mass Flow Controller ...