六、与同类期刊的比较 和同类期刊比较起来,《Journal of Dynamic Behavior of Materials》有其自身的特性和优势劣势。从影响因子(1.2)角度看,相对部分Q1分区或者在材料领域排名非常靠前的期刊而言并不高,如一些在材料科学领域顶尖的综合性期刊,可能影响因子达到3 - 5或者更高,这意味着在某些评价体系下,该期刊在最顶...
《材料动态行为杂志》(Journal Of Dynamic Behavior Of Materials)是一本以Multiple综合研究为特色的国际期刊。该刊由Springer Nature出版商刊期4 issues per year。该刊已被国际重要权威数据库SCIE收录。期刊聚焦Multiple领域的重点研究和前沿进展,及时刊载和报道该领域的研究成果,致力于成为该领域同行进行快速学术交流的...
Nie X, Song B, Loeffler CM, Journal of Dynamic Be- havior of Materials, (2015), DOI: 10.1007/s40870- 015-0005-7N. Bonora, G. Testa, A. Ruggiero, G. Iannitti, N. Mortazavi, and M. Ho¨rnqvist, Journal of Dynamic Behavior of Materials 1, 136-152 (2015)....
《Journal Of Dynamic Behavior Of Materials》国际简称:J DYNAM BEHAV MAT,是由出版商Springer Nature出版的一本致力于发布--研究新成果的的专业学术期刊。主要发表刊登有创见的学术论文文章、行业最新科研成果,扼要报道阶段性研究成果和重要研究工作的最新进展,选载对
TheJournal of Dynamic Behavior of Materialsis a peer-reviewed publication focused on the science and engineering of material and structural responses under time-dependent conditions. The journal emphasizes both extreme operational conditions — such as high strain rates, extreme temperatures, large plastic...
Journal of the Dynamic Behavior of Materials is a peer reviewed archival journal on the science and engineering of material and structural response to dynamic loading emphasizing high strain-rate, impact, blast, penetration, and shock response. The journal publishes experimental, theoretical, modeling ...
大类:Materials Science小类:Materials Science (miscellaneous)Q282 / 196 58% 大类:Materials Science小类:Mechanics of MaterialsQ2190 / 398 52% 名词解释: CiteScore:由Elsevier集团开发,类似影响因子用来评估杂志期刊学术影响力的一个指标。CiteScore采用了四年区间来计算每个期刊的学术引用。CiteScore拥有自带数据...
Journal of Dynamic Behavior of Materials EI ESCI JST JCR:Q3 JCR:Q4 发文量 433 被引量 2,695 影响因子(2023) 1.549主办单位: SPRINGERNATURE 出版周期: 季刊国际标准连续出版物号: ISSN 2199-7446 创刊时间: 2015年 收录汇总 栏目浏览 期刊详情 收录汇总 出版文献 期刊详情 分析评价 ...
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GS Dhaliwal,GM Newaz - 《Journal of Dynamic Behavior of Materials》 被引量: 11发表: 2016年 Simulation of growth of Cu on Ag(001) at experimental deposition rates The initial stages of growth of (001)Cu films on (001)Ag substrates have been investigated using the temperature-accelerated dyn...