JESD22-B116A Wire Bond Shear Test
Test Method B116A Revision of Test Method B116 JEDEC Standards No. 22-B116A Page 2 2 Terms and definitions (cont’d) 2.3 bonding surface: Either 1) the die pad metallization or 2) the package surface metallization to which the wire is ball-, wedge-, or stitch-bonded. 2.4 bond shear...
JESD22-B116A Wire Bond Shear Test Method 引线键合的剪切试验.pdf,JEDEC STANDARD Wire Bond Shear Test Method JESD22-B116A (Revision of JESD22-B116, July 1998) AUGUST 2009 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications cont
Test Method B116A Revision of Test Method B116 TEST METHOD B116A WIRE BOND SHEAR TEST (From JEDEC Board Ballot JCB-09-62, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices.)