因为他们之前最信赖的、能够有效散热的封装是TO247和TO220,所以工程师们需要我们新提出的顶部散热封装在散热能力上能够与TO247和TO220对等。” 程文涛回忆到,“这也是我们研发QDPAK和DDPAK时的主要考量——对标TO220和TO247。在同样的功率等级以及更高功率密度的情况下,如果QDPAK和DDPAK没有更好的效能,很难说服工程...
Newly-Published JESD247 Specification is JEDEC’s First Standard for Multi-Wire, Multi-Level Chip-to-Chip SerDes July 26, 2016 -- Kandou Bus has announced that their Glasswing™ GW28-125-USR interface macro that has been manufactured, tested and characterized, is compliant to the newly ...
WV-T247-101E[更多] Ohmite Mfg Co Heat Sinks Heatsink for TO-247 DEGREASED RoHS: Compliant | pbFree: Pb-Free 搜索 DR127-101-R[更多] Eaton Corporation Fixed Inductors 100uH 3.64A 0.163ohms RoHS: Compliant | pbFree: Pb-Free 搜索 10126-6000EC[更多] 3M Interconnect D-Sub Micro-...