JEDEC STANDARD No.10:(LOW FREQUENCYPOWER TRANSISTORS)低频功率晶体管 JESD201:(Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes)锡和锡合金表面处理锡晶须敏感性的环境验收要求 IPC-A-610E-2010:(Acceptability ofElectronic Assemblies)电子组件的可接受性 ...
Additionally, TSC packaging offers up to 35 percent lower thermal resistance than standard bottom-side cooling (BSC). By enabling the use of both PCB sides, TSC packages offer better board space utilization and at least two times more power density. The thermal management of the packages is als...
whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, ...
-ii-JEDEC Standard No.51-2A Page 1 INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS -NATURAL CONVECTION(STILL AIR) (From JEDEC Board Ballot JCB-07-111,formulated under the cognizance of the JC-15.1 Committee on Thermal Characterization Techniques for Electronic Packages and Interconnects...
JEDEC Standard No. 282B.01 -iv- SILICON RECTIFIER DIODES CONTENTS (continued) Page Figures 1.1 Cross section of a semiconductor rectifier diode 10 1.2 Typical semiconductor rectifier diode packages 10 1.3 Sketches of typical semiconductor rectifier stacks 11 ...
免费在线预览全文 JEDEC标准 JEDEC STANDARD Test Boards for Area Array Surface Mount Package Thermal Measurements JESD51-9 JULY 2000 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of...
Portable Data Terminal 智能电表 AC伺服系统 X-ray Inspection Machine for Security 监控摄像机 Intercom / Baby Monitor Fingerprint Authentication Device 步进电机 监控摄像机(IP网络) Datasheet Switching Diodes(JEDEC & Euro standard) - BAW56BAW56
SEMATECH White Paper #99083813A-XFR, Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages. JEDEC Standard No. 94A Page 4 4 Determining application specific test requirements It is necessary to determine the range of use conditions the solid state device...
79-2C May-2006 DDR2 SDRAM 规范 DDR2 SDRAM SPECIFICATION This comprehensive standard defines all required aspects of 256Mb through 4Gb DDR2 SDRAMs with x4/x8/x16 data interfaces, including pinout, addressing, functional description, features, ac and dc parametrics, truth tables, and packages. ...
20 -iii- JEDEC Standard No. 79-4 -iv- JEDEC Standard No. 79-4 Page 1 1 Scope This document defines the DDR4 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this Standard is to define the minimum ...