JEDEC JESD47L(中英文对照版).pdf,JEDEC STANDARD 电子工程设 计发展联合 协会 (现为 固态技术协 会)标准 Stress-Test-Driven Qualification of Integrated Circuits 集成电路基于压力测试的考核 JESD47L (Revision of JESD47K dated August 2018) DECEMBER 2022 JEDEC
JESD47L December 1, 2022 Stress-Test-Driven Qualification of Integrated Circuits This standard describes a baseline set of acceptance tests for use in qualifying electronic devices as new products, a product family, or as products in a process which is being changed. These tests... ...
完整英文电子版JEDEC JESD47L:2022(集成电路的应力测试驱动的鉴定 ) 完整英文电子版JEDEC JESD47L:2022 Stress-Test-Driven Qualification of Integrated Circuits - (集成电路的应力测试驱动的鉴定 )。本标准描述了一套基准验收测试,用于鉴定作为新产品、产品系列或作为正在改变的过程中的产品的电子设备。
(WCSP) 封装,间距为 0.5mm 2 应用 TMP139 是一款高精度温度传感器,具有与 I2C/I3C 兼 容的数字接口,支持带内中断 (IBI).TMP139 支持 JEDEC JESD302-1 对 B 级器件的接口要求,温度精 度超过了规范要求,可实现更高性能的 DDR5 存储器 模块.TMP139 采用紧凑的 6 焊球 DSBGA 封装,专 为高速,高精度和...
TMP139 SNIS217C – DECEMBER 2020 – REVISED MAY 2023 TMP139 0.5°C Accuracy, JEDEC DDR5 Grade B, Digital Temperature Sensor With I2C and I3C Interface 1 Features • Supports JEDEC JESD302-1 DDR5 Grade B temperature sensor • Exceeds JEDEC temperature accuracy specification: –±0.25°C ...
JESD47L December 1, 2022 Stress-Test-Driven Qualification of Integrated Circuits This standard describes a baseline set of acceptance tests for use in qualifying electronic devices as new products, a product family, or as products in a process which is being changed. These tests... ...