JEDEC JESD22-B111A：2016 Board Level Drop Test Method of Components for Handheld Electronic Products(手持式电子产品元件的板级跌落测试方法)JEDEC JESD22-B112B ：2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature（高温下的表面贴装集成电路的封装翘曲测量）JESD22-B...
JEDEC JESD22-B112B :2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature(高温下的表面贴装集成电路的封装翘曲测量) JESD22-B113B:2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products - 用...
JEDEC JESD22-B112B :2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature(高温下的表面贴装集成电路的封装翘曲测量) JESD22-B113B:2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products - 用...
JEDEC JESD22-B111A:2016 Board Level Drop Test Method of Components for Handheld Electronic Products(手持式电子产品元件的板级跌落测试方法) JEDEC JESD22-B112B :2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature(高温下的表面贴装集成电路的封装翘曲测量) JESD22-B...
JEDEC JESD22-B112B :2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature(高温下的表面贴装集成电路的封装翘曲测量) JESD22-B113B:2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products - 用...
JEDEC JESD22-B112B :2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature(高温下的表面贴装集成电路的封装翘曲测量) JESD22-B113B:2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products - 用...
34 JESD22-B111 A Nov 2016 现行 手持电子产品组件的板级跌落试验 35 JESD22-B112 B Aug 2018 现行 高温封装翘曲度测试方法 36 JESD22-B113 B Aug 2018 现行 手持电子产品组件互连可靠性特性的板级循环弯曲试验方法 37 JESD22-B114 B Jan 2020 现行 标识可识别性 ...
JEDEC JESD22-B110B.01:2019 Mechanical Shock – Device and Subassembly JEDEC JESD22-B111A:2016 Board Level Drop Test Method of Components for Handheld Electronic Products JEDEC JESD22-B112B :2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature ...
• Component ball pad diameter follows the requirements listed in the applicable JEP95Design Guide document.• Board warpage in the component land area is less than or equal to 25% of the balldiameter (b).The flatness and coplanarity measurement methods shall follow JESD22-B112 and JESD22-...
pad diameter follows the requirements listed in the applicable JEP95 Design Guide document.•Board warpage in the component land area is less than or equal to 25% of the ball diameter (b).The flatness and coplanarity measurement methods shall follow JESD22-B112 and JESD22-B108, respectively.