Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications 预览IPC J-STD-006C-2013前三页 标准号 IPC J-STD-006C-2013 2013年 总页数 36页 发布单位 IPC - Association Connecting Electronics Industries ...
用于电子以外应用的焊料应使用 ASTM B-32 进行采购。该标准是一组三个联合行业标准之一,规定了电子行业使用的焊接材料的要求和测试方法:IPC/EIA J-STD -004 助焊剂要求IPC/EIA J-STD-005 焊膏要求IPC J-STD-006 电子焊接应用的电子级焊料合金以及助焊剂和非助焊剂固体焊料的要求。 购买 正式版...
IPC-J-STD-006B JOINT INDUSTRY STANDARD Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications IPC J-STD-006B January2006 Supersedes J-STD-006A May2001
1.1ScopeThisstandardprescribesthenomenclature,requirementsandtestmethodsforelectronicgradesolderalloys;forfluxedand non-fluxedbar,ribbon,andpowdersolders,forelectronicsolderingapplications;andfor“special”electronicgradesolders.Thisisaquality controlstandardandisnotintendedtorelatedirectlytothematerial’sperformanceintheman...
Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications 4th INTERIM FINAL IC I N D N U O S R T T R C I E E L S E A EST. 1924 S N S I O O C I AT Notice EIA and IPC Standards and Publications are designed to serve the pub...
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Incorporates Amendment A1 and A2: October 2009 作废 标准号 IPC J-STD-006B-2008 2008年 总页数 36页 发布单位 美国电子电路和电子互连行业协会 ...
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications (Incorporates Amendment 1: August 1996) IPC J-STD-006-1995 发布历史 IPC J-STD-006-1995由IPC - Association Connecting Electronics Industries 发布于 1995-01-01,并于 1998-06-...
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications 作废 2006-01 预览IPC J-STD-006B-2006前三页 标准号 IPC J-STD-006B-2006 2006年 总页数 30页 发布单位 美国电子电路和电子互连行业协会 ...
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications首页 标准 IPC J-STD-006C-2013 耗材谱 IPC J-STD-006C-2013 预览[下载] 仪器设备 2 仪器谱 50 耗材4 发布历史IPC J-STD-006C-2013...
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications IPC J-STD-006C-2013 中,可能用到以下仪器 焊接锡膏冰箱 北京福意联医疗设备有限责任公司 国内锡膏冰箱 北京福意联医疗设备有限责任公司 ...