There is only one designation that remotely makes sense, given the four choices that you have, and that is OR. Below is an example of how the J-STD test results may look for a no-clean solder paste that has a classification as OR. Since most OR classified no-clean solder pastes and...
The classified methods and requirements of American national joint industry standard J-STD-004 were introduced in this article simply, and a comparison between J-STD-004 and other flux standard has been taken too. Meanwhile, basic means and principles of Choosing and using fluxes have been present...
4) Ask about the classification standard.The revised standard has been in force for roughly 5 years. If a flux formulation is over 5 years old, it was l ikely classified under the previous system; if it is less than 5 years old it was l ikely classified under the current system. Some...
If no lead-free solder paste is specified, the default composition shall be Sn96.5Ag3.0Cu0.5 (SAC305) per J-STD-005, flux type to be AABUS. Other lead-free paste solder alloys may be used AABUS. The solder paste shall meet the storage and shelf life requirements of the manufacturer's...
J-STD-002C-引脚-端子-焊片和接线柱可焊性测试.pdf,J-STD-002C Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 3rd Working Draft February 2004 J-STD-002C rd 3 Working Draft February 2004 1 SCOPE 1.1 Scope This standard prescr
J-STD-001E • Flux shall be in accordance with J-STD-004 or equivalent. 助焊剂应当符合J-STD-004或等效标准的要求 Flux shall [N1N2D3] conform to flux activity levels L0 and L1 of flux materials rosin (RO), resin (RE), or organic (OR), except ORL1 shall not [N1N2D3] ...
1.2.6 Flux Classification The material of composition, activity level and halide content of fluxes covered by this set of standards shall be specified according to J-STD-004. Final Draft for Industry Review 11-2012 J-std-006C 1.3 Definition of Requirements The word shall is used in the text...
J-STD-002Solderability test ponents leads, terminations, lugs, terminals and wires元器件管脚,端点,接线片,端子及联机的可焊性测试J-STD-003Solderability tests for printed boards印制板的可焊性测试J-STD-004Requirements for soldering flux焊接用助焊剂要求J-STD-005Requirements for solder paste焊接用锡膏...
The flux to be used in preparing the standard wire for test C shall conform to J-STD-004, Type ROL1. This flux shall not be used in performing the solderability tests for any of the methods herein. 3.2.2.1 Flux Maintenance The flux shall be covered when not in use and discarded after...
11 Flux Components shall be capable of withstanding the following fluxes and the flux materials outlined in J-STD-004: ? Mildly to highly activated water soluble fluxes ? No-clean fluxes ? Corrosive Flux (ph 1-2) only for PTH components and all SMT components where the Supplier has ...