IPC-Class 2标准主要适用于一般电子设备的制造,这些设备对焊接质量的要求较为一般,不需要特别高的可靠性和长期稳定性。该标准主要涉及焊接质量、焊接材料、焊接方法、焊接工艺控制等方面。 从焊接质量角度来看,IPC-Class 2标准要求焊接应该均匀、牢固、无裂纹、无虚焊、无过度焊接等缺陷。焊接材料方面,要求使用符合标准...
2级标准的露铜/镀层交叠区不大于1.25mm,3级标准的露铜/镀层交叠区不大于0.8mm; 2、芯吸(灯芯)不同 2级标准的芯吸不超过100um,3级标准的芯吸不超过80um; 2级标准的导线边缘粗糙,铜刺等缺陷的任意组合造成在孤立区域内的导线间距的减少不大于最小导线间距的30%,3级标准的导线边缘粗糙,铜刺等缺陷的任意组...
虽然 1 类电子产品通常便宜且易于更换，而 2 类电子产品更重要且需要更长的生命周期，但 3 类电子产品是关键任务产品。无论是起搏器还是军用雷达，需要满足 IPC Class 3 要求的产品必须使用高可靠性的电子元件，以确保不间断服务。这些电子产品通常质量最高，许多可以通过 2 类标准的 OEM 产品选择 IPC 3 类标准...
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多层厚铜PCB起泡的预防措施 一、原因分析: 1、板材质量差PCB板材质量不符合要求,如铜箔附着力不足、绝缘层材料性能不稳定等,都会导致铜皮与基材剥离,形成气泡。2、环境因素 空气湿度大或者通风 2024-11-18 17:19:52 PCB电气间隙和走线宽度要求 铜箔厚度IPC-2152(印刷电路载流能力)原文铜箔横截面积和电流的关系...
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The following article let readers know about the IPC Classes and the differences between Class 2 and Class 3 PCB types.
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One of the most common questions we receive is, “What is the difference between IPC Class 2 vs. Class 3 assembly processes?”. Since this is such a broad topic, we’ve decided to introduce a two-part series that describes some of the general differences and processes that go into buildi...
Class 2 of IPC-A-610 is commonly sought after for non-critical electronic assemblies where a long lifespan is preferred, though not crucial. Class 2 permits a degree of imperfection. For instance, surface mount components that are slightly misaligned, known as being 'off pad,' are generally ...