Draft IPC 9708 Originator: Mudasir Ahmad Rev1.2 assembly. These strains could eventually relax over time, but if mechanical strain is applied shortly after reflow, pad cratering could occur at lower mechanical strain levels. Figure 2: Example of a Pad Cratering Failure To mitigate this failu...
IPC-9708 Test Methods for Characterization of PCB Pad Cratering 1 SCOPE This document provides test methods to evaluate the susceptibility of Printed Circuit Board (PCB) materials and designs, to cohesive dielectric failure underneath surface mount (SMT) attach pads. The test methods can be used to...
IPC - Association Connecting Electronics Industries 当前最新 IPC 9708-2010 购买 正式版 “本文件提供了测试方法,用于评估印制板组件 (PBA) 材料和设计对表面贴装技术 (SMT) 连接焊盘下方的内聚介电故障的敏感性。这些测试方法可用于排序和比较不同的印制板材料和设计参数@,但不定义验收标准。性能分类 该测试...
标准号:IPC 9708 CD-2010 英文标准名称:Test Methods for Characterization of Printed Board Assembly Pad Cratering (To Purchase Call 1-800-854-7179 USA/Canada or 303-397-7956 Worldwide) 标准状态:A 标准类型:国际标准 相关标准 《ISO8124-6:2018(E)》玩具安全 第6部分-邻苯二甲酸酯含量测定 《EN71-...
IPC 9708 CD CHINESE-2010由IPC - Association Connecting Electronics Industries 发布于 2010-12-01,并于 2013-07-26 实施。IPC 9708 CD CHINESE-2010 印制板组件焊盘凹坑表征的测试方法的最新版本是哪一版?最新版本是 IPC 9708 CD CHINESE-2010 。