Bend Radius Capabilities Pre-bake Requirements And more… Attempting to apply all of 2223 would be unnecessary as not all items apply to every flex or rigid-flex PCB design, would significantly complicate the design process and negatively impact the finished part cost....
3%l Disk drive applications 0.1% 磁盘驱动器用途 0.1%R = radius of fold R = 折叠半径c = copper thickness c = 铜箔厚度D = dielectric thickness with adhesive D = 有接着剂介质厚度Polyimide coverlayer 聚酰亚胺覆盖层Adhesive layer 接着剂层Copper (c) 铜箔(c)Adhesive 44、layer 接着剂层...
IPC-2223B柔性电路板设计标准.pdf,IPC-2223B Sectional Design Standard for Flexible Printed Boards Flexible Circuits Design Subcommittee (D-11) FINAL DRAFT FOR INDUSTRY REVIEW September 2007 Published by IPC 3000 Lakeside Drive Suite 309S Bannockburn, IL 60
IPC2223中文版柔性电路板设计规范I目录1范围.5.1.1目的.5.1.2产品分类.5.1.2.1电路板分类.5.1.2.2安装用途.91.3修订版本.9.2适用文件.102.1 IPC .102.2联合行业标准 .103通用要求.10