IPC-MS-810 Guidelines for High VolumeMicrosection 大批量显微剖切导则 IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials 印制板、元器件及材料检验试验设备的认证 IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 Internation...
IPC-MS-810 Guidelines for High Volume Microsection 大批量显微剖切导则 IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials 印制板、元器件及材料检验试验设备的认证 IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 Internati...
IPC-MS-810Guideli nes for High Volume Microsection(显微切面指南)10/93 (orig. 45、 pub.)IPC-S-816SMT Process Guideline and Checklist( SMT 工艺指南和检查表)7/93 (orig. pub.)IPC-SM-817Gen eral Requireme nts for Dielectric SurfaceMou nting Adhesives (绝缘性表面组装胶粘 剂通用规范)11/89...
IPC-MS-810 Guidelines for High Volume Microsection 大批量显微剖切导则 IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials 印制板、元器件及材料检验试验设备的认证 IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 Internati...
153,IPC-9241,2016,English,微切片制备指南,GuidelinesforMicrosectionPreparation, 154,IPC-9252B ★,B,"中文 English",未组装印制板电气测试要求,"IPC-9252定义了适当的测试等级,协助选择测试分析仪、测试参数、测试数据和夹 具,用于执行未组装印制板和内层板上的电气测试。", ,IPC-9253,,,测试板卡设计文件压缩...
IPC标准中英名称对照
Guidelines for High Volume Microsection 大批量顯微剖切導則 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 多層印製板的鑒定與性能規範用預制內層在制板的鑒定與性能規範 Incoming Inspection of Raw Materials Manual 原材料接收檢驗手冊 Guidelines for Molded...
Guidelines for High Volume Microsection IPC-OI-645 Standard for Visual Optical Inspection Aids IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials IPC-2524 PWB Fabrication Data Quality Rating System IT-97061 PWB Hole to Land Misregistration: Causes and Rel...
IPC-MS-810 Guidelines for High Volume Microsection 大批量显微剖切导则 IPC-QL-653ACertification of Facilities that Inspect/Test Printed Boards, Components & Materials 印制板、元器件及材料检验试验设备的认证 IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 Internation...
原因和可靠性 IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多层板内部无焊盘层互连错位的可靠性 IPC-MS-810 Guidelines for High Volume Microsection 大批量显微剖切导则 IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components Materi...