1、過期的PCB可能會導致PCB表面的焊盤氧化 焊盤氧化會導致焊接不良,最終可能導致功能故障或脫落風險。 電路板的不同表面處理將具有不同的抗氧化效果。 原則上,ENIG要求在12個月內用完,而OSP要求在6個月內用完。 建議遵循PCB板工廠的保質期(保質期),以確保質量。 OSP板通常可以送回電路板廠,清洗OSP膜並重新塗覆一...
如果请问IPC1602里面对于标准的rigid PCB的化锡表面处理的存储和shelf life有什么样的定义? 请问PTH soldering 空洞建议是2D x-ray还是3D x-ray? 我们有一款SMT connector,它的结构跟ENIG底板一样,由金层中间有镍隔开,不同之处在于底板是沉金,connector是闪金,这样的情况下,我们的connector需要做除金吗? 001H里...
1.2 Purpose This guideline is intended to provide useful information on handling, packaging materials, environmental conditions and storage methods, for pcbs and assemblies. The scope of coverage will be from the manufacture of the bare pcb all the way to possible return of the assembled pcb for...
Along the SMT production direction, the short edge of each PCB travels through the reflow oven and its long edge is clamped on the SMT conveyor belt, as shown in Figure 1. This design helps to reduce deformation of printed circuit boards (PCBs). ...
and providing turn-key contract manufacturing services for our customer-designed PCBAs and system assemblies. Essentially, MSI's production processes adhere to ISO management standards. Throughout the whole production progress, from SMT, DIP, testing and packing, there is a high level of automation....
Shelf Life(密封寿命):MSD在MBB内保存所允许的时间。 Surface Mount Device(SMD):这里仅仅指的是那些塑料封装或者用其他会吸湿的材料封装的表面贴装器件。 Solder Reflow(回流焊接):通过熔化的锡膏或锡来把器件和PCB焊接到一起的过程。 Water Vapor Tramission Rate(WVTR):塑料胶片或刚化塑料胶片材料对湿气的渗透率...
i.e copper. It is a multifunctional surface finish, applicable to soldering, press fit connections and as the interface for Zero Insertion Force (ZIF) edge connectors. The immersion Tin protects the underlying copper from oxidation over its intended shelf life. Copper and Tin however have a very...
3Shelf Life(密封寿命):MSD在MBB内保存所允许的时间。3Surface Mount Device（SMD）:这里仅仅指的是那些塑料封装或者用其他会吸湿的材料封装的表面贴装器件。3Solder Reflow(回流焊接)：通过熔化的锡膏或锡来把器件和PCB焊接到一起的过程。3Water Vapor Tramission Rate（WVTR）:塑料胶片或刚化塑料胶片材料对湿气的...
The immersion silver protects the underlying copper from oxidation over its intended shelf life. Exposure to moisture and air contaminants, such as sulfur and chlorine, may negatively impact the useful life of the deposit. The impact can range from a slight discoloration of the deposit to the ...
该规范包括表面处理的外观检查,以及厚度参数、孔隙率、附着力、可焊性和锡须问题检查。您可点击此处获得IPC的完整副本。 日立分析仪器是IPC的成员,其大力推荐遵循IPC指南,以最大限度提高浸锡表面处理的质量和可靠性。我们开发的XRF仪器与快速发展的PCB技术保持同步,旨在帮助您实现生产的连续性和可靠性。