IPC-9701B_TOC表面贴装焊接连接的性能测试方法及鉴定要求.pdf,IPC-9701B Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments Developed by the SMT Attachment Reliability Test Methods Task Group (6-10d) of the Product Reli
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IPC9701A 表面贴装锡焊件性能测试方法与鉴定要求.pdf,IPC-9701A 表面贴装锡焊件性能测试方法 与鉴定要求 1.范围 此规范建立了专用的测试方法,用于评估电子组装件表面贴装焊接件的性能及可靠性。对应于 刚性电路结构、挠性电路结构和半刚性电路结构,表面贴装焊接件的性能
NASA BGA Qualification IPC-9701
当一起使用该标准与 IPC-SM-785 时,它能帮助用户了解 SMT 焊 27 IPC-9701A 表面贴装焊接连接的性能测试方 点失效的物理过程,并提供了适当的方法能够说明性能测试结果与使用环境中下 法及鉴定要求 的焊接连接可靠性的关系。当采用无铅焊点时,版本 A 中的附录 B 建议了如何修 改 本文件给出的热循环曲线。
Figure: 6 PCB Dimensions b) PCB assembly: The test sample build was deter- mined by IPC-9701, which calls for 32 fresh and 10 reworked solder joint assemblies. Seven boards with seven parts on each board gives 49 assembled parts. Reworking two parts from six boards renders 12 reworked ...
002B Solderability Tests for Component Leads, 95 Terminations, Lugs, Terminals and Wires 96 IPC/EIA J-STD-003A Solderability Tests for Printed Boards IPC-TR-461 Trouble-Shooting Checklist for Wave Soldering Printed 97 Wiring Boards IPC-TR-462 Solderability Evaluation of Printed Boards with ...
IPC 9701A - Performance Test Methods and Qualification Requirements for -9701 Surface Mount Solder Attachments IPC JEDEC 9702 - IPC/JEDEC Monotonic Bend Characterization of Board-Level / -9702 Interconnects IPC-9850 9850-K - Surface Mount Placement Equipment Characterization - KIT ...
95IPC/EIA J-STD-002B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 96IPC/EIA J-STD-003A Solderability Tests for Printed Boards 97IPC-TR-461 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards 98IPC-TR-462 Solderability Evaluation of Printed Boards...
IPC-HDBK-001Handbook and Guide to Supplement J-STD-001—Includes Amendment 1 J-STD-001辅助手册及指南及修改说明1 IPC-A-610D Acceptability of Electronic Assemblies 印制板组装件验收条件 IPC-HDBK-610Handbook and Guide to IPC-A-610(Includes IPC-A-610B to C Comparison IPC-610手册和指南(包括IPC...