In between it has issued specification for Immersion Silver 4553 and for Immersion Tin 4554. The committee has made a sincere effort to issue an OSP specification 4555. This effort did not produce results for various reasons. The committee has completed a revision of the immersion silver ...
English 印制板浸锡规范 Specification for Immersion Tin Plating for Printed Circuit Boards IPC-4555 2022 ENGLISH 印制板用高温有机可焊性防腐剂(OSP)的性能规范 Performance Specification for high Temperature Organic Solderability Preservatives (OSP) for Printed Boards IPC-4556 2013 2016 中文 English 印制...
,IPC-4555,2022,ENGLISH,印制板用高温有机可焊性防腐剂(OSP)的性能规范,PerformanceSpecificationforhighTemperatureOrganicSolderabilityPreservatives(OSP)forPrintedBoards, 96,IPC-4556,"2013 2016","中文 English",印制板化学镍/化学钯/浸金(ENEPIG)镀层规范,SpecificationforElectrolessNickel/ElectrolessPalladium/Immersio...
English 印制板浸锡规范 Specification for Immersion Tin Plating for Printed Circuit Boards IPC-4555 2022 ENGLISH 印制板用高温有机可焊性防腐剂(OSP)的性能规范 Performance Specification for high Temperature Organic Solderability Preservatives (OSP) for Printed Boards IPC-4556 2013 2016 中文 English 印制...