1.1 Scope This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. This specification is intended to set requirements for ISn deposit thickness
遵守IPC – 4554确保延长浸锡表面处理的有效期 2007年IPC规范IPC-4554适用于用作印刷电路板表面处理的浸锡(ISn)的生产。其特别关乎印刷电路板制造中,表面处理的焊接性能的可靠性和可重复性,并致力于克服这类表面处理浸锡层有效期难于持续六个月以上的难题。 浸锡表面处理是指将单层锡直接沉浸在印刷电...
Instances where your XRF measurements might be wrong Advice on how to set up your XRF equipment to get the right reading every time The four types of surface finish covered are: IPC-4552A ENIG IPC-4553A Immersion Silver IPC-4554 Immersion Tin ...
IPC-4554 January 1, 2007 Specification for Immersion Tin Plating for Printed Circuit Boards This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer... ...
中文 印制板浸银规范 Specification for Immersion Silver Plating for Printed Boards IPC-4554 2012 中文 English 印制板浸锡规范 Specification for Immersion Tin Plating for Printed Circuit Boards IPC-4555 2022 ENGLISH 印制板用高温有机可焊性防腐剂(OSP)的性能规范 Performance Specification for high Temperat...
中文 印制板浸银规范 Specification for Immersion Silver Plating for Printed Boards IPC-4554 2012 中文 English 印制板浸锡规范 Specification for Immersion Tin Plating for Printed Circuit Boards IPC-4555 2022 ENGLISH 印制板用高温有机可焊性防腐剂(OSP)的性能规范 Performance Specification for high Temperat...