HCC(High Count Core,高核数18)原来MCC在新架构下取消了 LCC(Low Count Core,低核数10) 左上角LCC,左下角HCC,右边XCC 新的whitley Platform,由于制成提升至10nm,最多可达到40core,且相比Purley平台增加了Memory Controller至4个,PCIe也提升到4.0,因此UCC的网状架构也首次被提出( Ultra Core Count ,超多核 4...
Intel出人意料地把HCC设计带到了消费级市场。Skylake的HCC是18或20核。为什么说“或”,因为和我们原先预想的稍有不同。如果你半年前问我,我会说HCC是18核设计。前几年的LCC为单环形总线,HCC设计都是双环形总线(可能不平衡),为了平均每个核心L3的延迟。上代E5V4 Broadwell-EP的设计MCC=这代HCCHCC=这代XCC。
分为 XCC 和 HCC 两个版本 XCC:1 Compute Die + 2 I/O Die[Primary+Secondary]HCC:1 Compute ...
This will be first major MCM product in a while and it remains to be seen whether they'll use EMIB or another interconnect fabric on the new chips. Currently, Intel has three different dies that include LCC (Low Core Count), HCC (High Core Count) and XCC (Extreme Core Count) configura...
Intel's gen1/gen2 Xeon Scalable Processors are based on one of three different die sizes: 28-core (XCC), 18-core (HCC), and 10-core (LCC). Block diagrams for each of these die are included in the Xeon Processor Scalable Memory Family Uncore Performance Monitoring Reference Manual (docum...